Finisar Corporation

Ii-vi Delaware, Inc.

The′ Linh Nguyen

Daniel Mahgerefteh

Rudolf J Hofmeister

Paul Kessler Rosenberg

Yasuhiro Matsui

Jimmy Alan Tatum

Luke M Ekkizogloy

Frank J Flens

Giorgio Giaretta

Jan Lipson

Henry Meyer Daghighian

Ilya Lyubomirsky

Bernd Huebner

Xiaojie Xu

Dev Kumar

Daniel K Case

David Adams

Jianxiao Chen

Christopher Kocot

James Prettyleaf

A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.

Surface coupled systems

A multi-channel receiver that includes a first clock recovery unit configured to recover a first clock signal associated with a first optical channel is disclosed. A first coefficient estimation unit estimates a first set of coefficients using the first clock signal. A second clock recovery unit configured to recover a second clock signal associated with a second optical channel using the first clock signal as a reference clock signal. A second coefficient estimation unit estimates a second set of coefficients using the first set of coefficients.

Clock recovery and equalizer estimation in a multi-channel receiver

An example embodiment includes a fiber optic integrated circuit (IC). The fiber optic IC includes an integrated power supply. The integrated power supply includes a filter, an active switch, and a pulse width modulator ('PWM'). The filter is configured to convert a signal to an output signal of the integrated power supply. The active switch is configured to control introduction of the signal to the filter. The PWM is configured to generate a PWM output signal that triggers the active switch.

Integrated power supply for fiber optic communication devices and subsystems

An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.

Optically enabled multi-chip modules

In one example embodiment, an optoelectronic module includes an optical receiver and a post-amplifier. The optical receiver is configured to receive an optical signal and generate an electrical data signal corresponding to the optical signal. The post-amplifier is electrically connected to the optical receiver and is configured to amplify the electrical data signal. The optoelectronic module further includes means for quantifying a quality of the optical signal from which the amplified electrical data signal is derived.

Quantifying link quality in an optoelectronic module

This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an optoelectronic assembly is provided that includes a TO package having a base through which one or more leads pass. The leads are electrically coupled to an optoelectronic device in the TO package, and are electrically isolated from the base. Some or all of the leads include a ground ring that is electrically isolated from the lead and electrically coupled with the base. A circuit interconnect is also included that is electrically coupled to the optoelectronic device and the TO package. The circuit interconnect includes a dielectric substrate having signal traces that are electrically coupled to the signal leads. A ground signal conductor disposed on the dielectric substrate is electrically coupled with the ground rings.

Circuit interconnect for optoelectronic device

An optoelectronic assembly includes a circuit board having a set of signal traces, where one or more of the signal traces has a junction point that integrates a pad of a circuit element. Exemplary circuit elements include a resistor, capacitor, and an inductor. The junction point has a first width and a first thickness, and the one or more signal traces have a second width and a second thickness. The dimensions of the junction point and the dimensions of the one or more signal traces are configured such that the first width and the second width are substantially similar, and that the first thickness and the second thickness are substantially similar. In one embodiment, the first width is no greater than 125% of the second width.

Transmission line with integrated connection pads for circuit elements

An optical transmitter and/or a constituent electro-optic transducer driver that performs active matching. The transducer driver performs active matching using a voltage step down through one base-emitter bipolar transistor, followed by a step up approach through the base-emitter of another bipolar transistor, thereby allowing for lower supply voltages. Furthermore, the voltage drop across the source resistor is minimal by using an operation amplifier in a feedback configuration, thereby further encouraging operability with low supply voltages. The electro-optic transducer driver is also beneficial in that it has high AC-coupling efficiency of the modulation current to the electro-optic transducer, may operate at high speeds with reduced jitter.

Growing community of inventors

San Jose, CA, United States of America

The′ Linh Nguyen