The Penn State Research Foundation

Lockheed Martin Corporation

Clemson University

Theresa S Mayer

Clara Rivero Baleine

Douglas H Werner

Thomas N Jackson

Kathleen Richardson

Christine D Keating

Jeffrey Linn Ruckman

Corey L Bungay

Peter Wachtel

Jonathan David Musgraves

Andrew Swisher

Stephen R Tuenge

Xiaoming Liu

Christina Hartsell Drake

Jeremy A Bossard

Robert P Drupp

Xiaotao Liang

Ling Li

Peter E Sieber

Christopher D Nordquist

Mingwei Li

Thomas Morrow

Jaekyun Kim

Mechanisms for customizing a refractive index of an optical component are disclosed. In one example, sub-wavelength openings are formed in a top layer of anti-reflective (AR) material of an optical component to tailor transmission characteristics of the AR material over a range of angles of incidence and a range of wavelengths. In another example, sub-wavelength openings are formed at different filling fractions in the surface of the optical component.

Customizing the refractive index of a surface

Customizing the refractive index of a surface using two dimensional pattern of subwavelength openings

A mask array apparatus includes a monolithic structure that includes a substrate layer transmissive for at least a portion of an infrared wavelength band and an array of individually addressed pixel structures. Each pixel structure is in stacked relation above or below the substrate layer, and includes at least one micro-plate heating element layer, circuitry, and at least one phase change material (PCM) element. The heating element layer is transmissive for the wavelength band, and has switchable on and off states configured to produce temperature changes. The circuitry is configured to individually address the heating element layer, separately from heating element layers in other pixel structures, to switch the heating element layer between the on and off states. The PCM is in stacked relation above or below the heating element layer and configured to change transmissive states in the wavelength band in response to the temperature changes.

Individually addressable infrared mask array

A refractive index device and method of making it include obtaining a glass structure comprising a plurality of nucleation sites. The glass structure is formed from a glass composition that comprises a first chemical component and a second chemical component. A crystal of the second chemical component has a different second refractive index from a first refractive index of the first chemical component. Each nucleation site defines where a crystal of the second chemical component can be grown. The method includes causing crystals of the second chemical component to grow in situ at a set of the plurality of nucleation sites in order to produce a spatial gradient of a refractive index in the glass structure.

Optical apparatus and method of forming a gradient index device

Provided are radio frequency electromagnetic energy switches and processes of regulating the transmission of RF energy, that for the first time successfully employ a ChG PCM as a RF switching material. An inventive switch includes: a substrate; a first radio frequency energy conductive element on the substrate; a second radio frequency energy conductive element on the substrate; and a switch element on the substrate and connecting the first conductive element to the second conductive element, the switch element including a switching material; the switching material including a chalcogenide compound switchable between a first radio frequency electromagnetic energy conductivity value and a second radio frequency electromagnetic energy conductivity value by application of an activation energy to the switching material, such that radio frequency electromagnetic energy flowing in the first conductive element is either reflected off the switching material or transmitted through the switching material to the second conductive element.

Radio frequency switch and processes of selectively regulating radio frequency energy transmission

Examples of the present invention include methods of assembling structures, such as nanostructures, at predetermined locations on a substrate. A voltage between spaced-apart electrodes supported by substrate attracts the structures to the substrate, and positional registration can be provided the substrate using topographic features such as wells. Examples of the present invention also include devices, such as electronic and optoelectronic devices, prepared by such methods.

Bottom-up assembly of structures on a substrate

An improved frequency selective surface (FSS) comprises a periodically replicated unit cell, the unit cell including a material having a first electrical conductivity in the presence of an external condition, and a second electrical conductivity in the absence of an external condition, or in the presence of a modified external condition. For example, the material may be a chemoresistive material, having an electrical conductivity that changes in the presence of a chemical or biological analyte, i.e. having a first value of electrical conductivity in the presence of the analyte, and a second value of electrical conductivity in the absence of the analyte.

Reconfigurable frequency selective surfaces for remote sensing of chemical and biological agents

The invention provides sensor, preferably biosensor devices and method of fabrication. The devices have significant advantages over the prior art methods having compatibility with future trends in clinical diagnostics and chemical detection. The underlying principle involves the integration of nanometer diameter, micron long metal or semiconductor rods onto a substrate to form a suspended nanomechanical cantilevers. The cantilever rods are rigidly attached to the substrate on one or both ends, and resonate at a characteristic frequency depending on the diameter, length, and stiffness of the rod. The metal or semiconductor rods are integrated onto the substrate using electrofluidic or fluidic assembly techniques. A receptor coating is placed on the metal or semiconductor rods prior to or following rod alignment using self-assembly chemistries. Sensing is accomplished when the target agent binds to the receptor substance, causing a change in the mass of the cantilever rod, and a corresponding change in the resonant frequency. This change in resonant frequency can be detected using an electrical readout. The sensing circuitry is integrated with CMOS or TFT technologies to form compact multi-analyte senor arrays on single crystal silicon, glass, or polymeric substrates. Circuits can also be included on the substrate to transmit the array data via wireless methods to a remote workstation for analysis. Devices may be integrated on chips with other analysis devices.

Integrated nanomechanical sensor array chips

An electro-fluidic assembly process for integration of an electronic device or component onto a substrate which comprises: disposing components within a carrier fluid; attracting the components to an alignment sites on the substrate by means of electrophoresis or dielectrophoresis; and aligning the components within the alignment site by means of energy minimization. The substrate comprises: a biased backplane layer, a metal plane layer having one or more alignment sites, a first insulating layer disposed between the backplane layer and the metal plane layer, and a second insulating layer, e.g., benzocyclobute, having a recess disposed therein, wherein the second insulating layer is on the surface of the metal plane layer opposite from the first insulating layer and wherein the recess is in communication with the alignment site.

Electro-fluidic assembly process for integration of electronic devices onto a substrate

This invention is directed toward a process of manufacturing, including a technique of assembling parts of an apparatus. The technique includes forming electrode structures on a substrate, suspending the apparatus part or parts in a dielectric medium between electrodes of the electrode structure, and using near-field (that is, short range) electric field forces to align the part or parts in pre-determined positions in accordance with the desired apparatus topography. The part or parts may include semiconductor die, nanometer wires for making connections to devices, or other components requiring precision alignment.

Electric field assisted assembly process

Growing community of inventors

Port Matilda, PA, United States of America

Theresa S Mayer