General Electric Company

Theresa A Sitnik

Herbert S Cole

James Wilson Rose

Lionel M Levinson

Thomas Bert Gorczyca

Yung S Liu

Siegfried Aftergut

John H Lupinski

Steven Thomas Rice

A plasticized polyetherimide, such as a blend of polyetherimide and a pentaerythritol tetrabenzoate ester, has been found useful as a low temperature laminating adhesive for making high density interconnect circuit arrays.

Plasticized polyetherimide adhesive composition and usage

A polyhydrazine is used to insolubilize a soluble polyimide. Soluble polyimide films on printed circuit boards can be insolubilized in this manner.

Insolubilization of soluble pre-imidized polyimides by polyhydrazine

A device containing a fluid material is sealed by sealant material placed essentially completely around the periphery of the device to join spaced apart first and second members of the device; and aperture is formed through the seal and the device interior is evacuated. Then fluid material is introduced into the device interior through the aperture and only a limited region of the device, confined substantially to the aperture is exposed to electromagnetic radiation from a laser or the like, to hermetically close the aperture when a photoreactive adhesive is injected into the aperture to cause the adhesive to solidify when contacted by the electromagnetic radiation. In an alternate embodiment, the aperture is filled with a plug of thermoplastic material, which is then selectively heat treated by a laser or the like to cause the plug to bind to the aperture boundary and hermetically enclose the fluid material.

Method for sealing an electronic device containing a fluid material

A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the irradiated substrate is coated with a catalyst also serves to remove the unirradiated portion of the ablatively-removable layer. The method is particularly suited for plating fine lines of metal, especially on non-planar surfaces.

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Scotia, NY, United States of America

Theresa A Sitnik