Motorola Corporation

Theodore R Golubic

Timothy Lee Olson

Brian A Webb

Maureen Sugai

Udey Chaudhry

Frank E Polka

Darrell Truhitte

A heatsink having isolated bonding pads formed on the heatsink eliminates breaking of the wire bond, lifting of the wire bond to the heatsink, and die attach material contamination of the bond. In one embodiment, the isolated bonding pad has an elevated pedestal configuration. In a second embodiment, the isolated bonding pad has an elevated pedestal configuration, so that the pedestal is also configured to lock a mold compound around the pedestal. In a third embodiment, the isolated bonding pad has an island configuration. In a fourth embodiment, the island configuration is configured to lock the mold compound formed around the island. The locking mechanism of the elevated pedestal or island prevents delamination of the mold compound to heatsink interface, preventing lifting or breaking of a wire bonded to the isolated bonding pad.

Semiconductor package having isolated heatsink bonding pads

A method of forming leads and providing a final test of a semiconductor package including an electronic circuit therein, the package having unformed leads. A forming and testing station is provided including a support for receiving the package, and dies movably positioned adjacent the support for contacting and forming the leads with test equipment connected to the dies. The semiconductor package is positioned on the support, and the leads of the package are contacted with the dies to connect the test equipment to the leads for testing the electronic circuitry in the package and to form the leads with this contacting step as the final manufacturing step.

Process and apparatus for forming and testing semiconductor package leads

A semiconductor chip module is formed by providing at least one semiconductor chip and a semiconductor substrate and bonding the semiconductor chip to the semiconductor substrate without the use of an epoxy or a metallic layer to create a bond between the semiconductor chip and the semiconductor substrate. The semiconductor chip of the semiconductor chip module is electrically connected to an external, electrical interconnection system. The semiconductor substrate has similar thermal properties to the semiconductor chip, this thermal mismatch present between a semiconductor chip and a metallic heatsink in conventional external, electrical interconnection systems is eliminated.

Unitary silicon die module

A single-in-line semiconductor package uses a multi-level heatsink having patterned conductors surrounding the semiconductor device. The patterned conductors are electrically isolated from the heatsink. Short bond wires are used to connect the semiconductor device to the patterned conductors. This arrangement eliminates the need for bonding shelves when bonding the leads and also increases the resistance of the bond wires from being swept away during encapsulation.

Multi-level semiconductor package

The present invention consists of a positive stop, pick up tool for use in precisely placing a die and leaving the required die attach material thickness between the die and the package substrate. The tool comprises: a body; a pad attached to the body for picking up dice; and positive stop pins attached to the body and extending a distance from the body equal to the distance the pad extends from the body plus the thickness of the die plus the required thickness of the die attach material.

Positive stop, pick up tool

A three dimensional interconnected modular integrated circuit and method of manufacturing same are provided wherein the modular circuit comprises individual planar integrated circuits which are connected together and to an interconnect chip for mounting on a lead line package resulting in an increase in available integrated circuit surface area for a given footprint area.

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Phoenix, AZ, United States of America

Theodore R Golubic