Thermatool Corporation

Theodore J Morin

Robert D Huppunen

Solder pot apparatus comprising a tank divided into first and second sections by a common wall with holes therein below the level of molten solder in the sections for the transfer of molten metal between the sections. The wall has relatively low heat conductivity. The sections are heated by separately controlled heating elements, the heating elements for the second section having a heating capacity higher than that of the first section, so that solder ingots may be rapidly melted in the second section without substantially affecting the solder temperature in the first section. A ramp extends from the first section to the second section and a powered skimmer stirs metal, and removes dross from metal, in the first section and pushes the dross over the ramp into the second section. Also, the apparatus includes a metal surface level sensor in the second section and signals and an ingot feeder conrolled by the sensor.

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New Canaan, CT, United States of America

Theodore J Morin