At&t Technologies, Inc.

American Telephone and Telegraph Company, At&t Technologies, Inc.

Theodore F Schaaf

Ching-Ping Wong

James T Huneke

John K Dorey, Ii

Bruce S Madsen

In an electronic device assembly comprising at least one circuit element an encapsulant therefor, wherein the encapsulant comprises a silicone resin characterized in that subsequent to the curing of said encapsulant, the resin is coated with a fine inorganic powder such as fumed or fused silica which essentially eliminates static charge and tackiness of the surface.

Antistatic and antitack coating for circuit devices

In a method for making a printed circuit board employing an aqueous type photoresist and including etching of the substrate surface with chromic acid after application of the photoresist mask, chromium is washed from the surface with a reducing agent at a pH of .ltoreq.10.

Additive processing electroless metal plating using aqueous photoresist

A process of reacting a selective area of an article with a heated liquid, such as by immersion in a heated electroless plating bath, utilizes a holder which is particularly suitable for use in retaining a plurality of printed circuit boards to be immersed in an electroless plating bath. The holder comprises a rigid base and a heat expandable foam bed mounted to the base, the foam bed having slits therein into which the printed circuit board is placed and held. Upon immersion of the article, the foam bed thermally expands to mask the article from the bath in the areas covered by the bed.

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Lawrence Township, NJ, United States of America

Theodore F Schaaf