Intel Corporation

Theodore Doros

Alexander Starikov

Krishna Seshan

A method of process variation compensation in step-and-scan lithography which comprises estimating a magnitude of a process error over a full imaged substrate surface and applying error correction during scan exposure over the full imaged substrate surface is provided in the disclosed embodiments.

Process compensation for step and scan lithography

Embodiments of the present invention form a weight-compensating/tuning layer on a structure (e.g., a silicon wafer with one or more layers of material (e.g., films)) having variations in its surface topology. The variations in surface topology take the form of thick and thin regions of materials. The weight-compensating/tuning layer includes narrow and wide regions corresponding to the thick and thin regions, respectively.

Method to make a weight compensating/tuning layer on a substrate

In an embodiment in accordance with the present invention, methods for dynamic detection and correction of focus and tilt variations that occur during a specific product layer exposure is by focus and tilt pre-compensation during wafer exposure. The method provides two spaced apart paths that provide both defocus and tilt measurements. A reference plane is defined by using three reference areas or fields. The data is fitted, using least squares or max/min error, to a 'plane', that is, to straight equidistant lines, the deviation from 'plane' is computed as error from a set of straight equidistant lines. Lateral displacements of each band into focus error is converted using the formula: &#x394;Z=&#x394;X*&#x3b8;.

Defect compensation of lithography on non-planar surface

Methods and apparatuses for shaping an illumination pattern for off-axis lithography are disclosed. A disclosed apparatus includes a first and second reflecting objective. The first reflecting objective includes a first reflective surface that reflects input light having an on-axis illumination pattern through a first focal point. The second reflecting objective includes a second reflective surface that receives the reflected light through the first focal point and through a second focal point aligned with the first focal point, and reflects the reflected light through an output end as output light having an off-axis illumination pattern. A disclosed method includes receiving collimated light with a conventional illumination pattern centered on an optical axis, symmetrically reflecting the collimated light in multiple directions away from the optical axis and reflecting the reflected light to create output light having an off-axis illumination pattern symmetrical about the optical axis.

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Sunnyvale, CA, United States of America

Theodore Doros