General Electric Company

Transportation IP Holdings, LLC

Ge Global Sourcing LLC

IP Transportation IP Holdings, LLC

Theodore Clark Brown

Mark Allen Murphy

Ajith Kuttannair Kumar

Andrew Louis Krivonak

Bret Dwayne Worden

Henry Todd Young

Michael Jay Grutkowski

Rajendra Yammanuru

Jason Daniel Kuttenkuler

Sean Patrick Cillessen

Shreenath Shekar Perlaguri

Arunpandi Radhakrishnan

Sudhir Kumar Gupta

Jain Raj Vettuvazhy Puthenpurayil

Gregory Alan Marsh

Aiqin Jiang

Zhao Zhang

Frank Dolski

Gui He

Emil Nikolaev Nikolov

Ajith Kuttainnair Kumar

Roland Donajkowski

Douglas Garvin

Jeffrey John Wolff

Brian Magann Rush

Naveenan Thiagarajan

Jacob Alan Hubbell

Jason A Dean

Laura Cooper

Christopher Wade McNally

Vinay Ramu

Vamsi Krishna Achanal

Praveen Haadige

Larry G Andreson

Ian Osborn

Zachary Brindak

Traction motor boot mount

A resistive grid includes a frame and at least one resistive element. The frame has a first frame end and a second frame end opposite the first frame end. The first frame end and the second frame end are joined by frame sides. The first frame end has a first length that is shorter than a second length of the second frame end. The at least one resistive element extends between the first frame end and the second frame end. The at least one resistive element has a first portion proximate the first frame end, and a second portion proximate the second frame end. The first portion is configured to have one or both of decreased heat generation or decreased electrical resistance relative to the second portion.

Resistive grid systems

Housing for a full phase module gate drive

Full phase module gate drive housing

Fluid control device

A system that may include a rigid bus bar body portion having one or more first conductive pathways, and a flexible bus bar body portion extending from the rigid bus bar body portion and having a lower modulus of elasticity than the rigid bus bar body portion, the flexible bus bar body portion including one or more second conductive pathways. The one or more first conductive pathways and the one or more second conductive pathways may be configured to be conductively coupled with a first electronic device to form a conductive connection between the first electronic device and at least a second electronic device.

Electrical system for bus bar coupling

A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.

Heat transfer chassis and method for forming the same

Electronics enclosure

A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.

An integrated mounting and cooling apparatus includes a housing body having a first mounting surface configured to receive electronic components to be cooled and a heat dissipation channel extending through the housing body under the first mounting surface. An array of cooling fins is disposed in the heat dissipation channel. The apparatus is configured to serve as a mounting surface for the electronic components, as a housing for the electronic components, and a heat-sink to cool the electronic components.

Integrated mounting and cooling apparatus, electronic device, and vehicle

Busbar chopper module

A system includes a grid coupled to an electrical bus; an electrical power modulation device coupled to the electrical bus that can output modified electrical power received from the electrical bus; a blower motor coupled to the electrical power modulation device that can receive the modified electrical power output and can provide a stream of air to affect a temperature of the grid, and a controller. A speed of the blower motor may be based at least in part on an amount of the modified electrical power. The controller can receive an operating parameter, and is responsive to that parameter by causing the electrical power modulation device to vary the amount of the modified electrical power. A blower motor speed may be controlled based at least in part on the operating parameter.

Blower system and method

Inverter housing

Growing community of inventors

Ripley, NY, United States of America

Theodore Clark Brown