Ciba-geigy Corporation

Theobald Haug

Alfred Renner

Andre Schmitter

Jurg Kiefer

Friedrich Stockinger

Roland Darms

Bruno Schreiber

Harry Beyeler

Kurt Meier

Wolfgang Scharf

Peter Ruf

Imre Forgo

Albrecht Muller

Jurg Keifer

A laminate prepared by combining at least two layers wherein at least one of which is made of a fibrous material, an epoxy resin having on average at least two 1,2-epoxide groups per molecule or a mixture of these epoxy resins and a ferrocene derivative of the formula [R.sup.1 (Fe.sup.II R.sup.2).sub.a ].sup.ab+ ab.[X].sup.-, wherein a and b independently of one another are 1 or 2, R.sup.1 is a .pi.-arene, R.sup.2 is a .pi.-arene or an indenyl- or cyclopentadienyl anion, X.sup..crclbar. is an anion [LQ.sub.m ].sup..crclbar. or an anion of a partly fluorinated or perfluorinated aliphatic or aromatic sulfonic acid, L is P, As or Sb, Q is fluorine or some of the Q substituents may also be hydroxyl groups, and m corresponds to a value which exceeds the valence of L by unity, subjecting the layers to compression molding at such a temperature and pressure that a liquid resin matrix is present at the beginning of this step and an initial fall in the viscosity is produced so that entrained gases can escape from the layers and crosslinking the laminated layers to obtain a rapid rise in viscosity such that the resin which flows out does not bind the compression mold.

Process for the preparation of laminates

A process for the preparation of a laminate including the steps

Polymers formed from anhydrides of the formula I ##STR1## in which R.sub.1 and R.sub.2 independently of one another are hydrogen or methyl. The novel polymers are suitable for use as curing agents for polyepoxide compounds.

Polymers formed from allyl-substituted or methallyl-substituted,

A flexible, printed circuit with excellent adhesion of the printed tracks, which is obtained by coating one side of a metal foil without an intermediate layer with a polymer consisting of a polyamide, polyimide or polyamide-imide containing siloxane groups, which is obtainable by crosslinking a silicon-modified polyamide prepolymer, polyamide-acid prepolymer or polyamide-amido-acid prepolymer of the formula I, heating the coated metal foil in the temperature range from 50.degree. to 300.degree. C. till a tack-free coating is obtained, exposing the opposite side of the coated metal foil, which side is provided with a photolacquer, through a photo mask, and developing the exposed metal foil.

Flexible, printed circuit

Heat-curable mixtures containing (a) epoxy compounds having on average more than one 1,2-epoxy group per molecule, (b) monoimides or polyimides of specific unsaturated dicarboxylic acids of the formula I ##STR1## wherein A is an x-valent aromatic or aliphatic radical, R.sup.1 is hydrogen or methyl, and x is 1, 2 or 3, and (c) products of condensing specific phenols, specific amines and aldehydes or ketones in an acid medium. The novel curable mixtures have a long shelf life and give rise to moulded materials which are highly resistant to chemicals and resistant to boiling water.

Heat-curable epoxy resin mixtures containing imide compounds and

Curable mixtures containing (a) epoxide compounds with on average more than one 1,2-epoxide group per molecule, (b) the condensates prepared from certain phenols, certain amines and aldehydes or ketones in an acid medium and, where relevant, (c) curing accelerators. The novel curable mixtures have a good storage stability and give shaped substances with outstanding resistance to chemicals.

Curable epoxy resin mixtures

Flexible base materials consisting of a metal foil and a film, firmly adhering thereto without an interlayer, of a polyamide/polyimide block copolymer of the formula I, or of a polyamide/polyimide copolymer prepared from a polyamide acid block of the formula IVa or Va and a dicarboxylic acid dichloride of the formula XI and a diamine of the formula XII. The individual symbols are defined in claim 1. The base materials according to the invention are suitable for the preparation of flexible printed circuits.

Flexible base materials, their preparation and their use for printed

Phenol-novolaks containing amino groups of formulas VI and VII ##STR1## wherein R.sup.1 is halogen, nitro, alkyl, alkoxy or phenyl, R.sup.2 is hydrogen, alkyl, cycloalkyl, phenyl or furfuryl, R.sup.3 is hydrogen or alkyl, R.sup.4 and R.sup.5 independently are alkyl, halogen, nitro or cyano, and x is 1 to 8, are obtained by reacting the corresponding phenol-novolak with an aldehyde or ketone of formula II ##STR2## and with a substituted aniline of formula III or IV ##STR3## in a molar ratio of 1 mol of phenol-novolak to 2 mols of compound of formula II and to 2 mols of compound of formula III or IV in an acid medium at a pH value of 0.5 to 3.0. The phenol-novolaks containing amino groups are useful curing agents for epoxy resins and are also suitable as starting compounds for the preparation of epoxy resins.

Phenol-novolaks containing amino groups

Flexible base materials consisting of a metal foil and a film of a polyamide, polyamide-imide and/or polyimide, firmly adhering thereto without an intermediate layer, the film being obtained by heating a polyamide, polyamide-amidoacid and/or polyamide-acid containing the structural units of the formulae I and II. The individual symbols are as defined in claim 1. The base materials according to the invention are useful for the production of flexible printed circuits.

Heat-curable mixtures of one or more epoxide compounds, which, on average, have more than one epoxide group in the molecule, and one or more .beta.-aminocrotonic acid derivatives, such as .beta.-aminocrotononitrile, .beta.-aminocrotonamide or .beta.-aminocrotonic acid esters, and also, if desired, a polyamine or polycarboxylic acid anhydride or a malenimide. The novel curable mixtures are distinguished by outstanding stability on storage, can be processed easily and give moulded materials with good mechanical properties.

Meat-curable mixture, which are stable on storage, of epoxide resin,

The process according to the invention is performed by reaction of epoxide resins with primary and/or secondary polyamines with simultaneous quaternizing by means of aromatic and aliphatic polysulfonic esters, halogen-free organic phosphoric esters, or organic compounds which contain at least 1 chlorine or bromine atom, and which are free from -COOH groups and corresponding salt groups. The crosslinked plastics thus obtained are distinguished by an improved electrical conductivity.

Process to manufacture crosslinked polymers

Heat-curable mixtures of one or more epoxide compounds, which, on average, have more than one epoxide group in the molecule, and one or more .beta.-aminocrotonic acid derivatives, such as .beta.-aminocrotononitrile, .beta.-aminocrotonamide or .beta.-aminocrotonic acid esters, and also, if desired, a polyamine or polycarboxylic acid anhydride or a maleimide. The novel curable mixtures are distinguished by outstanding stability on storage, can be processed easily and give moulded materials with good mechanical properties.

Heat-curable mixtures, which are stable on storage, of epoxide compounds

Novel crosslinked unsaturated polymers, which have better properties than conventional crosslinked unsaturated polymers are obtained by reacting a .beta.-aminocrotonic acid ester, .beta.-aminocrotononitrile or .beta.-aminocrotonamide with a diisocyanate or polyisocyanate and a polyol, for example at temperatures of between 50.degree. and 180.degree. C.

Growing community of inventors

Frenkendorf, Switzerland

Theobald Haug