Finisar Corporation

The' Linh Nguyen

Daniel Mahgerefteh

Jan Lipson

Rudolf J Hofmeister

Daniel K Case

Paul Kessler Rosenberg

Yasuhiro Matsui

Jimmy Alan Tatum

Frank J Flens

Giorgio Giaretta

Ilya Lyubomirsky

Bernd Huebner

Xiaojie Xu

David Adams

Jianxiao Chen

Philip D Shapiro

An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.

Optically enabled multi-chip modules including optical engine macros

A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.

Surface coupled systems

A method of performing clock recovery and equalizer coefficient estimation in a multi-channel receiver may include recovering, at a first clock recovery unit, a first clock signal associated with a first channel. The method may include estimating a first set of coefficients for a first equalizer associated with the first channel using the first clock signal. The method may include passing the first clock signal to a second clock recovery unit associated with a second channel. The method may also include recovering, at the second clock recovery unit, a second clock signal associated with the second channel using the first clock signal as a reference clock signal. The method may also include passing the first set of coefficients as initialization coefficients to a second equalizer associated with the second channel. The method may also include estimating a second set of coefficients for the second equalizer using the initialization coefficients.

Clock recovery and equalizer estimation in a multi-channel receiver

In an example, a self-testing integrated circuit (IC) includes N channels i and a controller, where i is an integer from 1 to N. Each channel i may include a clock and data recovery circuit (CDR), a pseudorandom bit stream (PRBS) generator circuit, and a PRBS checker and eye quality monitor (EQM) circuit. The controller may be configured to selectively couple the channels i in a daisy chain during self-testing.

Self-testing integrated circuits

The present invention relates generally to optoelectronic devices, and particularly to a submount, pedestal, and bond wire assembly for a transistor outline package. A bottom surface of the submount is connected to a top surface of the pedestal. Each bond wire in a bond wire set is connected to a position on the top surface of the submount, and to a position on the signal line. The signal line is positioned a first distance from the position on the top surface of the submount and a second distance from the pedestal. The submount is sized such that a portion of the bottom and the top surface of the submount extends beyond the top surface of the pedestal such that the first distance is less than the second distance.

Submount, pedestal, and bond wire assembly for a transistor outline package with reduced bond wire inductance

An optoelectronic assembly includes a transistor outline (TO) package that houses an optoelectronic device. The TO package and the optoelectronic device are coupled to a circuit interconnect. The circuit interconnect includes an insulator having a first side for transmitting a signal current between the optoelectronic device and a device external to the TO package, and a second side for transmitting a ground current between the TO package and the external device. For a predefined operating frequency range, the impedance of the circuit interconnect approximately matches the impedance of the signal leads of the TO package and also approximately matches the impedance of the device external to the TO package. The optoelectronic device may include a laser diode or a photo diode. In addition, the present invention is an optoelectronic transceiver including a transmitter optoelectronic assembly and a receiver optoelectronic assembly. The transmitter optoelectronic assembly includes a transmitter TO package and a transmitter circuit interconnect, and the receiver optoelectronic assembly includes a receiver TO package and a receiver circuit interconnect.

Circuit interconnect for optoelectronic device for controlled impedance at high frequencies

The optoelectronic device includes a photo diode and an amplifier, which amplifies output of the photo diode. The amplifier includes an input stage and an output stage. In one embodiment, the input stage has a series connection to a resistor, which is connected to a ground. The output stage has a connection to ground that does not overlap the series connection. In another embodiment, the input stage has a first connection to a bypass capacitor, which is connected to a power source. The output stage has a separate, second connection to the capacitor, which prevents high frequencies from flowing between the input stage and said output stage via a connection to the power source.

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San Jose, CA, United States of America

The' Linh Nguyen