Micron Technology Incorporated

Thanh K Mai

Gary L Howe

Daniel B Penney

Brian L Brown

Christopher B Cooper

David R Brown

Sujeet V Ayyapureddi

Matthew Alan Prather

Scott Eugene Smith

Vijayakrishna J Vankayala

Parthasarathy Gajapathy

Brian J Ladner

Randy Brian Drake

The present disclosure includes apparatuses and methods to transfer data between banks of memory cells. An example includes a plurality of banks of memory cells and a controller coupled to the plurality of subarrays configured to cause transfer of data between the plurality of banks of memory cells via internal data path operations.

Bank to bank data transfer

A memory device includes a command interface that when operating receives a write command, an input output interface that when in operation receives data signals in conjunction with the write command, and error detection circuitry coupled to the input output interface. The error detection circuitry is configured to generate a first signal indicative of a first period of time during which a first determination is made regarding a first portion of the data signals utilizing a first data strobe signal as a first clock signal, generate a second signal indicative of a second period of time during which a second determination is made regarding a second portion of the data signals utilizing a second data strobe signal as a second clock signal, and generate a control signal based upon the first signal, the second signal, and a slower of the first data strobe signal and the second data strobe signal.

System and method to control memory error detection with automatic disabling

The systems and methods described herein relate to a bi-directional data path (DQ) symbol map generated based on error correction operations. A device may include sub-wordline drivers and bi-directional data paths (DQs) that couple between the sub-wordline drivers and input/output (I/O) interface circuitry based on assignments indicated by the DQ symbol map. The assignments may be generated based on error correction operations performed on data of the memory bank. In particular, the DQ symbol map may be generated to avoid some conditions that, if occurring, may render one or more data errors uncorrectable. These systems and methods may reduce a likelihood of a data error associated with a DQ being uncorrectable.

Routing assignments based on error correction capabilities

A memory device includes cyclic redundancy check (CRC) circuitry configured to indicate whether an error has been detected in transmission of data from a host device to the memory device. The CRC circuitry includes a synchronous counter that is configured to synchronize a count with a system clock and to transmit the count. The CRC circuitry also includes pulse width control circuitry that is configured to receive the synchronized count from the synchronous counter and to generate pulse width controls based at least in part on the synchronized count. Furthermore, the CRC circuitry includes synchronization circuitry that is configured to receive the pulse width controls and to generate an error alert signal based at least in part on the pulse width controls.

CRC error alert synchronization

A semiconductor device may include a plurality of memory banks, a plurality of mode registers that may control an operational mode associated with each of the plurality of memory banks, and a set of global wiring lines coupled to each of the plurality of mode registers. The set of global wiring lines may include a first global wiring line to transmit data to each of the plurality of mode registers, a second global wiring line to transmit an address signal to each of the plurality of mode registers, a third global wiring line to transmit a read command signal to each of the plurality of mode registers, and a fourth global wiring line to transmit a write command signal to each of the plurality of mode registers.

Distributed mode registers in memory devices

A RAMBUS dynamic random access memory includes a test control circuit that selectively couples a row address latch to either a row sense control signal or a CMD control signal. In a normal operating mode, the test control circuit couples the row address latch to the row sense control signal so that the row sense control signal both latches a row address and senses a row of memory cells corresponding to the latched address. Prior to conducting a core noise test, the test control circuit couples the row address latch to the CMD control signal so that the row address is latched by the CMD control signal, and the row sense control signal only functions during the core noise test to sense a row corresponding to the latched row. The memory also includes a multiplexer that receives a time-multiplexed data/address bus and simultaneously couples a first part of the data/address bus to an internal data bus and a second part of the data/address bus to an internal address bus.

Growing community of inventors

Allen, TX, United States of America

Thanh K Mai