Abb Power Electronics Inc.

Other

Lucent Technologies Inc.

General Electric Company

Zierick Manufacturing Corporation

Thang Danh Truong

John Andrew Trelford

William Lonzo Woods, Jr

Alok Kumar Lohia

Richard John Yeager

William L Woods

Randy T Heinrich

Allen Frank Rozman

Robert Joseph Roessler

Janos Legrady

Shiaw-Jong Steve Chen

Matthew Anthony Wilkowski

Roger J Hooey

Yi Teh Shih

Raymond W Pilukaitis

Jon P Martin

Richard D Lytle

Clifton L Lindsey

Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.

Interposer printed circuit boards for power modules

Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.

Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.

A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.

Stencil set and system for printing solder paste for printed circuit boards

There is provided electrical contact for circuit boards. Each leg of the pin section has a deformable segment that can expand or contract along the direction of the leg to alleviate stress created by relative movement of printed circuit boards and/or off-board components interconnected thereby. The deformable segments have members that project in opposing directions relative to the direction of the leg, so that the segments are symmetrical. In one embodiment, each leg has a deformable segment having a outwardly curved shape. In another embodiment, each leg has a deformable segment in the shape of a rectangular frame. The deformable segments define at least one opening where the two legs of the pin section are not overlapping, which breaks the capillary flow of solder between the legs. The amount of solder that flows into the electrical contact is selectively controlled by the selected placement of the deformable segments.

Compliant surface mount electrical contacts for circuit boards and method of making and using same

An inter-substrate conductive mount for a surface mountable circuit board, a method of manufacturing the circuit board and a surface mountable power magnetic device. In one embodiment, the circuit board includes: (1) a substrate, (2) an inter-substrate conductive mount composed of a material having a melting point above a solder reflow temperature and including a compliant solder joint at an interface of the substrate and (3) a solder located proximate the conductive mount, the conductive mount of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the conductive mount in contact with the substrate as the solder is brought to the reflow temperature, the conductive mount being capable of mounting the substrate to an adjacent substrate and providing a conductive path therebetween.

Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same

An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement. The apparatus comprises a metal substrate having a first side and a second side, a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum alternated with at least one first-side dielectric stratum affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum alternated with at least one second-side dielectric stratum affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.

Circuit board apparatus

The present invention provides a method for soldering components to a printed wiring board. In one embodiment, the method comprises applying a substantially lead-free solder to the printed wiring board, placing an electronic component having lead-free terminals on the solder, and heating the printed wiring board in a substantially oxygen-free atmosphere to a temperature sufficient to reflow the solder. In an alternative embodiment, the method may further comprise applying a tin-based solder. In a particularly advantageous embodiment, the method includes applying a solder alloy of tin and a metal selected from the group consisting of: silver, antimony, copper, and gold.

Lead-free solder process for printed wiring boards

A surface mountable power supply and a method of manufacturing the power supply. In one embodiment, the power supply includes: (1) a substrate having opposing upper and lower conductive layers (2) a lower electrical component having a first lead mounted on a first pad on the lower conductive layer and subject to forces capable of detaching the lower electrical component from the substrate when the power supply passes through a reflow soldering process, (3) an upper electrical component having a second lead mounted on a second pad on the upper conductive layer, (4) a solder located proximate the first lead, the lower electrical component of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the lower electrical component in contact with the lower conductive layer as the power supply passes through the reflow soldering process, (5) a planar magnetic device mounted on the substrate, the planar magnetic device having windings formed from a portion of conductive traces on the upper and lower conductive layers and a core disposed through apertures of the substrate and proximate the windings and (6) an inter-substrate conductive mount, coupled to the lower conductive layer, composed of a material having a melting point above a solder reflow temperature and adapted to mount the power supply to an adjacent substrate and provide a conductive path therebetween, the conductive mount including first and second compliant solder joints at interfaces of the substrate and the adjacent substrate, respectively.

Growing community of inventors

Grand Prairie, TX, United States of America

Thang Danh Truong