At&t Bell Laboratories

Lucent Technologies Inc.

Avaya Technology LLC

American Telephone and Telegraph, Co.

Thaddeus Wojcik

Louis Thomas Manzione

Hui Wu

Ron Jay Barnett

Richard Franklin Schwartz

Ilya Alexander Korisch

Alexander Coucoulas

John W Benko

Charles Joseph Buondelmonte

Ram J Arvikar

An optical fiber retention device that has a generally planar body having a surface coated with an adhesive. The optical fiber is affixed to the surface by adhering to the adhesive coated surface such that the surface holds the fiber in position but the fiber can be easily removed by pulling the desired length of fiber off of the coated surface. A plurality of tabs extend outwardly from the planar body and contact the printed circuitboard for positioning the planar body at a predetermined distance away from the circuitboard to enable electronic components to be located on the circuitboard beneath the planar body. The tabs also have a planar surface coated with an adhesive that contacts the circuitboard to mount the optical fiber retention device to the circuitboard.

Optical fiber retention device

A new physical design for electronic devices ( ) comprises a multi-layer stacked assembly ( ) of a plurality of pan-shaped conductive units that form the layers of the assembly. Each unit is preferably formed from a single sheet of metal into which electronic components, such as an antenna array ( ) or a filter array ( ) of a transceiver, have been stamped, cut, or etched, and which is then bent around its periphery to form a pan shape. The pans are oriented to face the same direction, are stacked one on top of another, and are fixedly attached to each other by weld, solder, or adhesive. The electrical components defined by the different units are electrically interconnected in a connectorless manner, preferably by flanges ( ) formed in the same sheets of metal as the units themselves and extending between the units. Adjacent units in the stack define electromagnetically isolated chambers, e.g., for the filter array. Some layers perform double duty, e.g., a layer ( ) that forms a part of the chamber that houses the filter array also acts as a reflector plane for the antenna array.

Electronic stacked assembly

An electronic device package is made by first making in a stencil member (11) an opening (12) in the shape of a closed loop that surrounds an inner portion (13) of the stencil member. The closed loop is a continuous opening except for a plurality of web members (15), each of which extends across the opening to secure the inner stencil portion to the remainder of the stencil member. A glass slurry (7) is forced through the opening of the stencil member onto a first substrate (18) so as to form on the substrate a substantially closed loop of glass slurry, which is thereafter glazed to form a glass loop (32) bonded to the first substrate. The first substrate is used as cover plate and placed over a second substrate (24) containing an electronic device (23) such that the glass loop surrounds the electronic device and contacts the second substrate along its entire length. The glass is heated sufficiently to soften it and cause it to bond to the second substrate as well as the first substrate. Cooling of the glass loop develops continuous hermetic seals to both first and second substrate, thereby to isolate the electronic device from the external environment.

Method for hermetically sealing electronic devices

An improved stencil (10), for screen printing a material (22) onto a substrate (20), comprises a sheet (12) provided with a plurality of trapezoidal openings (14) arranged in alternating fashion such that the taper of each opening is opposite to the taper of the opening adjacent thereto. Providing the stencil with alternating trapezoidal openings (14) improves the resolution of the pattern of material (22) printed on the substrate when the material is deposited on the stencil and a squeegee blade (24) is displaced thereacross to force the material into the openings (14). The quality of the pattern of the material (22) printed on the substrate (20) can be further improved by providing a friction-reducing coating (34) on the sheet (12) to reduce the drag of the squeegee blade (24) as it travels thereacross.

Method and apparatus for screen printing

The present invention relates to a method for depositing a viscous material (11), such as solder paste, onto a substrate (16), such as a printed circuit board. The solder paste is expelled (12) out from a dispenser (20) into a void between a pair of flexible members (30) extending therefrom for contact with a foraminous member (12) such as a stencil, proximate the printed circuit board. A relative motion is imparted between the dispenser and the foraminous member so that at least one of the flexible members forces the solder paste through the openings in the stencil and onto the circuit board. In accordance with the invention, the dispenser is pivoted when the relative motion is imparted between the dispenser and the stencil to raise the leading one of the flexible members a predetermined distance from the stencil. In this way, the solder paste expelled from the dispenser will remain substantially confined between the flexible members, yet be allowed to mix with whatever portion of the solder paste (typically flux) remains on the stencil after the previous pass of the dispenser thereacross.

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Hopewell, NJ, United States of America

Thaddeus Wojcik