Huawei Technologies Co., Limited

Tewei Chen

Nan Zhao

HuiLi Fu

Guowen Liu

An integrated circuit package apparatus deployed with an antenna and a method for manufacturing an integrated circuit package apparatus, where the integrated circuit package apparatus includes a package substrate, an antenna, a chip, and a connection circuit. The package substrate includes at least one ground plane, the antenna is deployed on an external surface of one side of the package substrate and is located on one side of the at least one ground plane, the chip and the connection circuit are deployed on the other side of the at least one ground plane, where the antenna is isolated from the chip and the connection circuit using the at least one ground plane, and the antenna is coupled to the chip using the connection circuit and a first metal through hole in a thickness direction of the package substrate.

Integrated circuit package apparatus deployed with antenna and method for manufacturing integrated circuit package apparatus

A conical inductor provided in the present invention includes: a housing, a conical coil located inside the housing, a first pin and a second pin respectively connected to two ends of the conical coil, where one end of the first pin is connected to one end of the conical coil, the other end of the first pin is connected to a hole in a first side wall of the housing in a fastened manner, one end of the second pin is connected to the other end of the conical inductor, and the other end of the second pin is connected to a hole in a second side wall of the housing in a fastened manner; and each of the first pin and the second pin includes one segment of waveform segment fluctuating in a direction perpendicular to a top wall of the housing.

Growing community of inventors

Shenzhen, China

Tewei Chen