Kabushiki Kaisha Toshiba

Tetsuya Yokoi

Morihiko Ikemizu

There is here disclosed a semiconductor device comprising a semiconductor element, a first substrate disposed to face one side of the element, being provided first internal wirings on a main surface, and being provided first external wirings connected to the respective first internal wirings on another main surface, and a second substrate formed to be larger than the element by a material having flexibility, being disposed to face another side of the element, being provided second internal wirings having one-end portions extended to edges of a main surface, and the one-end portions connected to the first internal wirings with being bent toward the first substrate together with the edges, being mounted the element having an electrode connected to some of the second internal wirings on the main surface, and being provided external terminals connected to some of the second internal wirings on a middle of another main surface.

Semiconductor device and manufacturing method for the same

Disclosed is a film substrate comprising an insulative sheet including a first region to be separated, having a slit on an outer peripheral line of the first region, and on which a semiconductor device chip is to be mounted, and a conductive pattern formed on the insulative sheet, crossing the slit, and to be connected to an external terminal of the semiconductor device chip.

Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device

Bumps each having a pointed tip end or grooves are formed on electrodes of a chip, and they pierce wiring layers of an insulating film substrate such as an interposer so as to tear an oxide film or a contaminated layer produced on the surface of each of wiring layers. A new interface of the material is enabled to be continuously produced between the bumps and the wiring layers, thus making it possible to obtain an excellent electrical connection among them.

Growing community of inventors

Tokyo, Japan

Tetsuya Yokoi