Sanyo Electric Co., Ltd.

Sugan Co., Ltd.

Nippon Shokubai Co., Ltd.

Other

Panasonic Intellectual Property Management Co., Ltd.

Kowa Company Limited

Sumitomo Chemical Company, Limited

Semiconductor Components Industries, LLC

Sanyo Semiconductor Co., Ltd.

Nippon Shokubai Kagaku Kogyo Co., Ltd.

Masayoshi Yokoyama

Panasonic Intellectual Property Corporation of America

Sun Patent Trust

Tetsuya Yamamoto

Akihiko Nishio

Hidetoshi Suzuki

Seigo Nakao

Masayuki Hoshino

Ayako Horiuchi

Alexander Golitschek Edler Von Elbwart

Takashi Iwai

Lilei Wang

Yoshihiko Ogawa

Hiroshi Yamamoto

Tomofumi Takata

Yasuaki Yuda

Ankit Bhamri

Akio Naka

Ryosuke Usui

Chi Gao

Quan Kuang

Tsuyoshi Rakuma

Yoshio Okayama

Hiroyuki Kobayashi

Yasunori Inoue

Hideki Mizuhara

Hiroyuki Umezawa

Hiroshi Maeda

Rikin Shah

Hongchao Li

Naoki Yasuda

Masahiro Iseki

Koichi Saito

Tomoya Nunome

Teruhiko Kumada

Hideharu Nobutoki

Yasuyuki Yanase

Tatsuhito Matsuda

Kiyoshi Shibata

Masahiro Yoshida

Yoshikuni Mori

Tadahiro Yoneda

Kenichi Kawaguchi

Muneharu Ishikawa

Tomohito Koizumi

Hajime Kobayashi

Hiroshi Suzuki

Yasutaka Nakatani

Naoya Shibaike

Yorinobu Yoshisato

Seiji Suzuki

Takuya Kamiyama

Hiroaki Usui

Kazuo Takahashi

Yoichi Uchida

Toru Arakawa

Toshio Fukushima

Masurao Yoshii

Yukiko Nishio

Michihiko Matsushima

Tsuguo Takaya

Toshiaki Sugita

Yoh Takano

Kiyoaki Kudo

Daijo Tomihisa

Hiroko Harada

Fumiyuki Adachi

Keiko Kurokawa

Yui Ogawa

Masayuki Motegi

Takashi Shibasaki

Yasuaki Funae

Satohiko Takanashi

Susumu Iijima

Kazuhiko Takahashi

Mitsuhiro Dobashi

Yoshiaki Shirasawa

Takamasa Onuki

Hiroshi Noguchi

Shigeki Kawamura

Sanae Taniguchi

Koji Ogino

Yasaki Funae

Manabu Takemura

Tsuyoshi Watanabe

Yukiko Hori

Sydney Sheung Chee Chung

Ryuichi Hirano

Akira Hichiwa

Yoshiaki Kubota

Atsushi Sugahara

Tooru Arakawa

Norio Fukushima

This stopcock flow path switching device includes: a three-way stopcock having a flow path switching cock and provided to, by switching of the flow path switching cock, allow flow path switching between a state in which a contrast agent introducing flow path is formed by coupling a flow path on the patient side to a flow path on the injector head side and a state in which a blood pressure measuring flow path is formed by coupling the flow path on the patient side to a flow path on the blood pressure transducer side; and a clamp mechanism for closing the flow path of the three-way stopcock communicating with the injector head side, in the state in which the blood pressure measuring flow path is formed.

Stopcock flow path switching device

An injector head with rotation mechanism allows selection between a state in which a syringe assumes a priming orientation with a through hole of the syringe positioned upper than the injector head body, and a state in which the syringe assumes a contrast agent injectable orientation with the through hole of the syringe positioned lower than the injector head body.

Injector head with rotation mechanism

In the joint mechanism, when connecting a plunger to a piston, after engaging members of a plunger-side engaging region in a retracted state pass through a first engaging wall region of a piston-side engaging region, the engaging members of the plunger-side engaging region come into a projected state in a second engaging wall region and the projected state of the engaging members is fastened by a fast block, and thereby, the plunger-side engaging region engages with the piston-side engaging region.

Joint mechanism

The priming method includes the steps of: in a state where a contrast agent bag containing a contrast agent is coupled to a second tube moving a second piston in a second syringe backward to introduce the contrast agent to the second syringe, and with a first tube kept open, moving the second piston in the second syringe forward to discharge air in the second syringe to the outside and to fill the first tube with contrast agent.

Priming method

A semiconductor module has a first substrate and a second substrate placed opposite to the first substrate. A first semiconductor element is provided such that the high-heat main face of the first semiconductor faces the second substrate and is thermally connected to the second substrate via a wiring layer. A second semiconductor element is provided such that the high-heat main face of the second semiconductor faces the first substrate and is thermally connected to the first substrate via another wiring layer. The emitter electrode of the first semiconductor element and the collector electrode of the second semiconductor element are electrically connected to each other via a heat spreader.

Semiconductor module and an inverter mounting said semiconductor module

Disclosed is an inverter having improved power conversion efficiency. The inverter () converts direct current power supplied from a plurality of direct current power supplies (V, V) having different voltages into alternating current power. The inverter () is provided with a control unit (). The control unit () generates modified sine waves using a power supply voltage (E) of the power supplied from the first direct current power supply (V), a power supply voltage (E) of the power supplied from the second direct current power supply (V), and a potential difference (E&#x2212;E) between the two power supply voltages. The control unit () generates the modified sine waves by controlling H bridge circuits provided for the direct current power supplies (V, V), respectively.

Inverter and power converter having inverter mounted therein

Microwave oven with heater

In a valve-equipped hand switch and a chemical liquid introduction system, a contrast medium in a syringe is delivered to a patient line through a first port, a main passage around a spacer portion, and a second port. Furthermore, a pressure (about 300 psi) of the contrast medium delivered by a chemical liquid introduction device is transmitted as a reaction force through a third plunger from a handle portion of an operation piston held by an operator. As such, the operator can directly feel the pressure of the introduced contrast medium, which gives a sense of ease to the operator during operation.

Valve-equipped hand switch and chemical liquid introduction system

Provided is a circuit device having a configuration in which thermal interference between built-in elements is suppressed and being miniaturized in total size. A hybrid integrated circuit device of the present invention includes: a circuit substrate, a sealing resin and leads. The circuit substrate in its upper surface is incorporated with a hybrid integrated circuit formed of semiconductor elements and the like respectively fixed to heat spreaders. The sealing resin coats the circuit substrate and thus seals the hybrid integrated circuit. The leads each extend to the outside while being fixed to a pad formed of a conductive pattern. In this hybrid integrated circuit device, the semiconductor elements are mounted on the respective heat spreaders at positions offset from each other, and thereby are arranged to be spaced away from each other.

Circuit device

A water softening module has a case body which includes cover members secured to their respective ends of a cylindrical case. A pair of electrodes are provided in the case body. A fibrous medium is located in contact with a water-outlet-side face of the electrodes. The fibrous medium has a stacked structure constituted of a first fiber layer and a second fiber layer, which are electrically conductive. The first fiber layer is positioned in contact with the upstream side of the second fiber layer, and the first fiber layer is positioned in contact with the downstream-side face of the electrodes. The specific surface area of the first layer is smaller than that of the second fiber layer.

Water treatment apparatus

An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.

Semiconductor module, method of manufacturing semiconductor module, and mobile device

In a semiconductor module having the structure in which a bump electrode provided on a wiring layer is connected to a device electrode provided on a semiconductor device, connection reliability between the bump electrode and the device electrode is improved. An insulating resin layer is provided between the semiconductor device and the wiring layer. The bump electrode, formed integrally with the wiring layer and projected from the wiring layer toward the insulating resin layer, is electrically connected to the device electrode provided on the semiconductor device. Part of the height of the wiring layer on the end side in a bump connection area is lower than that of the wiring in a wiring area extending toward the side opposite to the end side.

Device mounting board and semiconductor module

A device mounting board includes: an insulating resin layer; a wiring layer disposed on one main surface of the insulating resin layer; and a bump electrode connected electrically to the wiring layer and protruding on a side of the insulating resin layer from the wiring layer. A side surface of the bump electrode is curved inwardly toward the center axis of the bump electrode as viewed in a cross section including the center axis of the bump electrode, and the radius of curvature of the side surface changes continuously from a wiring layer end to a head end of the bump electrode.

Device mounting board and manufacturing method therefor, and semiconductor module

There is disclosed a cleaning device for a heat exchanger which safely and effectively cleans the heat exchanger and which can sufficiently obtain a deodorizing effect and a sterilization effect. The cleaning device for the heat exchanger includes an electrolysis unit for treating dew condensation water of the heat exchanger by an electrochemical technique, a supply unit for supplying electrolytic water produced by the treatment performed by this electrolysis unit to an outer surface of the heat exchanger, and an control unit for controlling the electrolysis unit and the supply unit, and the control unit allows the electrolysis unit to electrolytically treat the dew condensation water of the heat exchanger and produce the electrolytic water, and allows the supply unit to supply the produced electrolytic water to the outer surface of the heat exchanger.

Cleaning device for heat exchanger

A board adapted to mount an electronic device includes an insulating resin layer, a wiring layer of a predetermined pattern provided on one surface of the insulating resin layer, a bump electrode provided on an insulating-resin-layer-side surface of the wiring layer, and a covering, formed of a metal layer, which covers a top surface of the bump electrode and a region, at a side surface of the bump electrode, continuous with the top surface excluding a region in contact with the wiring layer.

Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device

Growing community of inventors

Osaka, Japan

Tetsuya Yamamoto