Intel Corporation

Sumitomo Metal (smi) Electronics Devices, Inc.

Sumitomo Metal Ceramics Inc.

Tetsuya Yamamoto

Roy Bell

Shizuki Hashimoto

Hideyuki Yoshino

Rusli Othman

Yoji Tozawa

Akihiro Hidaka

A lid for sealing a semiconductor package containing a semiconductor chip, a semiconductor package making use of the lid, and a method for producing the lid. The lid has a solder layer along the peripheral side of a ceramic plate. The solder layer has a portion of an increased solder thickness and a portion of a reduced solder thickness extending along the peripheral direction. When sealing the semiconductor package, a gas confined within the inside of the semiconductor chip mounting site of the package substrate may be discharged from the semiconductor package for realizing hermetic sealing.

Lid with variable solder layer for sealing semiconductor package,

In a ceramic lid for sealing a semiconductor device mount portion of a ceramic package substrate having a semiconductor device mounted thereon, a seal layer disposed in an outer peripheral edge portion of a lid is formed by a solder comprising 2 to 15 wt % of Bi, 2.0 to 6.0 wt % of Sn, 0.5 to 2.0 wt % of In, 0.5 to 2.0 wt % of Ag and the balance of Pb, through an Ag--Pt system underlying metallized layer. A semiconductor package comprising a semiconductor package substrate and a lid is sealed by the lid.

Lid for semiconductor package and package having the lid

Growing community of inventors

Mine, Japan

Tetsuya Yamamoto