Shin-etsu Chemical Co., Ltd.

Sanyo Chemical Industries, Ltd.

Towa Corporation

Tetsuya Yamada

Tomoyuki Gotoh

Takehisa Matsuda

Tetsuya Watanabe

Tetsuji Yoshimura

Naohito Ogiso

First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.

Compression molding method for electronic component and compression molding apparatus employed therefor

A medical adhesive comprises a hydrophilic urethane prepolymer (UP) obtained by reacting a fluorine-containing nonaromatic polyisocyanate component (A) and a polyol component (B) having a hydrophilic polyol (B), and a phenolic radical scavenger (PRS). The content of (PRS) is preferably 0.01 to 3% by weight based on the weight of (UP). The content of oxyethylene groups in (B) is preferably 30 to 100% by weight based on the weight of the oxyalkylene groups in (B). Preferably, (B) is a mixture of a random copolymer obtained by addition of ethylene oxide and propylene oxide to diols and polypropylene glycol. The content of isocyanate groups in the medical adhesive is 1 to 10% by weight based on the weight of (UP). The medical adhesive is suitable for bonding body tissues, such as lung, artery and heart in particular.

Medical adhesive

Photosensitive composition and use thereof

Growing community of inventors

Kyoto, Japan

Tetsuya Yamada