Kuraray Co., Ltd.

Maruishi Sangyo Co. Ltd.

Tetsuya Watanabe

Takashi Katayama

Shinya Kato

Toshiyasu Yajima

Yukio Goto

To provide a polishing pad () useful for polishing semiconductor materials having a high hardness. The polishing pad () is used for polishing a workpiece () in combination with loose grains and comprises a polishing surface () comprising a textile of high-tenacity organic fibers, the fiber has a tenacity of not lower than 15 cN/dtex. In the textile, the high-tenacity organic fiber may have a single fiber fineness within the range between 0.3 dtex and 15 dtex, or a total fineness of within the range between 3 dtex and 3,000 dtex. The fiber may include, for example, a fully-aromatic polyester fiber.

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Osaka, Japan

Tetsuya Watanabe