Shinkawa Ltd.

Tohoku University

Tetsuya Utano

Kohei Seyama

Yuichiro Noguchi

Toru Maeda

Akinobu Teramoto

Jun'ichi Takahira

Masanori Hamajima

A mounting deviceis equipped with: two direct-acting voice coil motorsin which a movable elementreciprocatingly moves along an axis A relative to a fixed element; and a colletA mounted on an end part side of the movable elements, the colletA holding a semiconductor chipby suction. The plurality of voice coil motorsare disposed so as to be set away from each other along a direction intersecting the axes A, and in a manner that the axes A are parallel to each other. The colletA is mounted so as to straddle chucksprovided at the end parts of the two movable elements

Mounting device

A mounting apparatus for mounting a semiconductor chip on a mounting body includes a stage on which the mounting body is placed, a mounting head provided to be movable up and down above the stage and pressing the semiconductor chip against the mounting body, and a film disposition mechanism which interposes a belt-like cover film between the mounting head and the stage, and the film disposition mechanism includes a film feeding part having a feeding reel around which at least the cover film has been wound, a film recovery part having a recovery reel also winding up at least the fed cover film, and one or more relay shafts provided in the course of a path of the cover film from the feeding reel to the recovery reel and by which the cover film is folded back in order to bend a moving direction of the cover film.

Mounting apparatus

A mounting apparatus includes: a bonding stage; a base; a mounting head for performing a temporary press-attachment process in which semiconductor chips are suction-held and temporarily press-attached to a mounted object and a final press-attachment process in which the temporarily press-attached semiconductor chips are finally press-attached; a film arrangement mechanism arranged on the bonding stage or the base; and a controller which controls driving of the mounting head and the film arrangement mechanism. The film arrangement mechanism includes: a film feed-out mechanism which has a pair of feed rollers with a cover film extended there-between and successively feeds out a new cover film; and a film movement mechanism which moves the cover film in a horizontal direction with respect to a substrate.

A wiring structure () includes: a fixed member (); a movable member () which moves rectilinearly with respect to the fixed member (); a wire material () which connects the movable member () and the fixed member (); a movable guide () over which the wire material () is stretched and which can move rectilinearly with respect to the fixed member (); and a movement mechanism () which causes the movable guide () to move, in conjunction with the rectilinear movement of the movable member (), rectilinearly in a direction in which the loosening or tightening of the wire material () caused by the rectilinear movement of the movable member () is offset.

Wiring structure with movement mechanism

A device for linearly moving bases with respect to an object, includes first and second bases, a linear scale provided with graduations at pitches in the moving direction, first and second encoder heads attached to the first and second bases, and a control unit. The control unit maintains an interval between the first and second encoder heads to be constant, and moves the first and second bases while sequentially detects a first and second graduation numbers, and calculates a distance on the scale between the first and second encoder heads by multiplying a difference between the first and second graduation numbers by the pitch, and calculates a position correction coefficient of the scale as a ratio of the interval with respect to the calculated distance, and controls the movement amount of the first movable body and the second movable body based on the position correction coefficient.

Device and method for linearly moving first and second moving bodies relative to target object

The present invention is provided with: a base moving linearly relative to a substrate and having a first and second positions that are spaced apart from each other by a predetermined interval a in the movement direction; a linear scale where a plurality of graduations having a predetermined pitch are provided along the movement direction; encoder heads which respectively are disposed at the first and second positions of the base and detect first and second graduation numbers of the linear scale with respect to the first and second positions, wherein, as the base is moved along the linear scale, the first and second graduation numbers are detected in this order in the respective encoder heads, and the movement amount of the base is controlled on the basis of the ratio between the predetermined interval and the distance between the first graduation number and the second graduation number on the scale.

Apparatus and method for linearly moving movable body relative to object

A bonding apparatus includes a bonding stage on which either a rectangular substrate or a circular substrate can be installed; a first transport mechanism which transports the rectangular substrate from a first carry-in unit to the bonding stage and from the bonding stage to a first carry-out unit; and a second transport mechanism which transports the circular substrate from a second carry-in/out unit to the bonding stage and from the bonding stage to the second carry-in/out unit, in which a first transport path determined by the first transport mechanism and a second transport path determined by the second transport mechanism partially overlap.

Bonding apparatus

This mounting device () comprises: a base () that moves linearly in relation to a substrate (); a bonding head () that is attached to the base (); a camera () that is attached to the base () and identifies the position of the substrate (); a linear scale () having a plurality of graduations along the movement direction; a bonding head-side encoder head (); and a camera-side encoder head (). A control unit () causes the base () to move to a position where the bonding head-side encoder head () detects the position of a graduation. Due to this configuration, positioning accuracy of a semiconductor die () in relation to the substrate () is improved.

Device and method for positioning first object in relation to second object

[Object] To provide a plasma apparatus capable of igniting plasma reliably over a long period. [Solution] The apparatus includes a hollow structural body () having a hollow structure along an axis, a first electrode () disposed inside the hollow structural body (), and a second electrode () having a structure that externally covers a plasma generation area () of the hollow structural body (). The first electrode () has a deformation structure () within the plasma generation area of the hollow structural body.

Plasma apparatus and method for producing the same

Provided is a plasma ignition technique allowing easy and reliable ignition and reignition of plasma without monitoring or manual handling. A plasma ignition system according to this technique is provided with a radio-frequency power supply configured to supply a predetermined high frequency signal to an applied electrode for generating plasma; a matching device configured to match impedance on a side of the radio-frequency power supply and impedance on a side of the applied electrode; a forward wave/reflected wave detector configured to detect a forward wave and a reflected wave of the high frequency signal; a high-voltage generator configured to generate a predetermined high voltage; and a controller configured to superimpose the high voltage on the high frequency signal when a ratio of the reflected wave to the forward wave is greater than a first threshold value.

Plasma ignition system, plasma ignition method, and plasma generating apparatus

A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed.

Growing community of inventors

Tokyo, Japan

Tetsuya Utano