Toppan Printing Co., Ltd.

Toppan Inc.

Tetsuya Tsukada

Shonosuke Mizoguchi

Eriko Hatakeyama

Yukiko Katano

Shinji Kaneko

Shin Kataoka

Eriko Uehara

Shigeki Minemura

Hiroshige Nihei

An IC card provided with an IC chip, and configured to enable at least one of contact communication and contactless communication, the IC card including an ultrasonic fingerprint sensor connected to the IC chip and a storage unit in which fingerprint data for matching is stored. An outer surface of the IC card is formed of synthetic resin, and the ultrasonic fingerprint sensor is covered with the synthetic resin.

IC card and method for manufacturing IC card

A card-type medium includes: a card body; an internal component embedded in the card body; an exposed component partially exposed on a front surface of the card body; and a circuit board to which the internal component and the exposed component are bonded, wherein the circuit board includes a first connection portion to which the internal component is bonded, a second connection portion to which the exposed component is bonded, the second connection portion being located at a position different from the first connection portion in a card thickness direction connecting the front surface of the card body and a rear surface on an opposite side of the card body to the front surface, and a connection wiring portion that connects the first connection portion and the second connection portion, the connection wiring portion extending in a direction including the card thickness direction.

Card-type media

An electromagnetic-coupling dual IC card includes an IC module and a plate-like card body. The IC module includes a module substrate having a first surface and a second surface, contact terminals provided on the first surface of the module substrate to be contactable with an external contact-type device, an IC chip having a contact communication function and a contactless communication function and disposed on the second surface, and a first connecting coil provided on the first surface. The plate-like card body includes an antenna sheet embedded therein and has a recess for holding the IC module, the antenna sheet being provided with a coupling coil to be electromagnetically coupled to the first connecting coil, and a main coil connected to the coupling coil to perform contactless communication with an external contactless-type device. The first connecting coil does not overlap with the contact terminals in plan view.

Electromagnetic-coupling dual IC card and IC module

A dual IC card with an IC chip having both a contact-type transmission function and a contactless-type transmission function, and a module substrate having an external terminal, which is a contact-type transmission portion, and a connecting coil, which is a contactless-type transmission portion; an antenna sheet including an antenna substrate having first and second surfaces, a coupling coil having a second surface coil provided on a second surface of the antenna substrate, the coupling coil configured to be electromagnetically coupled to the connecting coil, and an antenna coil connected to the coupling coil for contactless communication with an external device; and a card body in a plate-shape housing the antenna sheet and with a recess for the IC module, with at least a part of the second surface coil positioned inside the recess when viewed in a thickness direction.

Dual IC cards and antenna sheets

A dual IC card of the present invention includes: an IC module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the IC module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.

Dual IC card

An IC module of the present invention includes: a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole; an IC chip provided to the first surface, having a contact communication function and a contactless communication function, and having two terminals formed thereon; a connecting coil formed on the first surface and having two ends; a contact terminal portion provided to the second surface and configured to contact an external contact machine; bridge wiring provided to the second surface, provided at a position overlapping with the first and second through holes, and electrically insulated from the contact terminal portion; a first conductive wire inserted through the first through hole and connecting the first terminal of the IC chip to the bridge wiring; a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and a third conductive wire connecting the second end of the connecting coil to the second terminal of the IC chip.

IC module, dual IC card, and method for manufacturing IC module

Provided is a composite IC card including: a card base having a recess; an antenna sheet arranged inside the card base; an IC module arranged in the recess of the card base. The IC module includes an IC chip having a module substrate provided with an external terminal, and a first coupling coil. The antenna sheet includes an antenna coil configured to perform reception of electric power and transmission and reception of signals with an external reader, and a second coupling coil connected to the antenna coil. The first coupling coil and the second coupling coil are arranged so as to be capable of achieving close coupling therebetween and configured to couple the IC module with the antenna sheet in a non-contact manner by trans coupling. The second coupling coil of the antenna sheet is arranged outside a region in which the recess of the card base is formed.

Growing community of inventors

Tokyo, Japan

Tetsuya Tsukada