Nitto-Denko Corporation

Tetsuya Terada

Amane Mochizuki

Masakazu Sugimoto

Yasufumi Miyake

Chiharu Miyaake

Munekazu Tanaka

Atsushi Hino

Kazuo Ouchi

Yoshinari Takayama

Toshihiko Sugimoto

Kenkichi Yagura

Masako Maeda

Takanori Miyoshi

Shoji Morita

Mikio Aizawa

Kazuto Shinozaki

A flexible wiring board which exhibits a sufficient flex life under high temperature working conditions. The flexible wiring board comprises an insulation layer provided on both surfaces of a conductor layer, optionally with an adhesive layer provided interposed therebetween, wherein the layers being in direct contact with both surfaces of the conductor layer exhibit an average complex shear modulus value of from 1.0&times;10,to 4&times;10,dyn/cm,at a temperature of 60&deg; C. and a frequency of 25 Hz.

Flexible wiring board

The present invention provides a rigid circuit member obtained by bending a composite laminate comprising a circuit conductor made of a metal foil interposed between plastic films having an elastic modulus of not less than 450 kg/mm,with an adhesive, characterized in that as said plastic film there is used a polyethylene naphthalate film. The present invention also provides a circuit board adapted to be connected to a conductor on a rigid substrate, characterized in that said circuit conductor is interposed between polyethylene naphthalate films. The present invention further provides a printed circuit board, comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm,, not more than 1.5&times;10,/&deg; C., a hygroscopic expansion coefficient of not more than 1.2&times;10,/%RH, a water vapor permeability of not more than 15 g/m,/mil day, a percent water absorption of not more than 2% and a melting point of not higher than 280&deg; C. and a conductor circuit integrated into a laminate with an adhesive layer provided interposed therebetween.

Circuit member and circuit board

A method of mounting a semiconductor device including a film carrier having an insulating film having on one side thereof a connecting lead and a semiconductor element junctioned with the film carrier on an outer substrate, which includes forming an opening for adhesive forcing or adhesive injection in the insulating film within its bonding area to be in contact with a land part on the outer substrate and in an area near the bonding area, connecting the connecting lead to the land part on the outer substrate, and forcing or injecting an adhesive through the opening formed in the insulating film into the space between the film carrier and the outer substrate.

Method of mounting semiconductor device

A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.

Wiring substrate, film carrier, semiconductor device made by using the

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Osaka, Japan

Tetsuya Terada