Nec Electronics Corporation

Nec Corporation

Tetsuya Tao

Akira Furuya

Hidemitsu Aoki

Kaoru Mikagi

Hiroaki Tomimori

Chikara Yamashita

Hiroyuki Tsukui

An oxide film formed on the surface of copper film of an electrode pad is cleaned by oxalic acid after unevenness is formed on the surface of copper film by treating the surface with organic acid. Thereby, stable resistance is obtained when carrying out a characteristic inspection by bringing a probe into contact with the electrode pad, and it is easily recognized by observation through a microscope that the probe is brought into contact with the electrode pad. In addition, wettability with respect to solder is satisfactory, and it is possible to favorably form a solder bump on the electrode pad.

Process for making a semiconductor device having a roughened surface

Semiconductor device having a roughened surface

In a semiconductor device which is formed by connecting electrodes of a package substrate composed of a resin and electrodes of a semiconductor chip formed of a silicon semiconductor, an underfill resin having the Young's modulus of less than 100 kgf/mm is filled in the gap of the junction between the semiconductor chip and the package substrate.

Semiconductor device

A bump formation plate is provided with a base and solder bumps formed on the base. The top portion of the solder bump inclines from the center thereof to the periphery thereof. A contact surface of the solder bump with the base may be flat. The base is made of, for example, aluminum or stainless steel.

Method of forming solder bumps on a semiconductor device using bump transfer plate

A packaged semiconductor device having high reliability that allows for a large number of pins and that provides good heat removal properties, and that can discharge the high pressure moisture in a gas state from the inside thereof to the exterior. The device includes a strengthening ring arranged around a semiconductor chip that includes a process type electrode and that is mounted on an isolated substrate; a resin to fill spaces between the semiconductor chip and the isolated substrate; and a cap on the semiconductor chip and the strengthening ring, wherein at least one vent is formed perpendicular to the direction of the thickness of the semiconductor chip.

Growing community of inventors

Tokyo, Japan

Tetsuya Tao