Koito Manufacturing Company, Ltd.

Tetsuya Suzuki

Akihiro Matsumoto

Tomoyuki Nakagawa

Naoki Sone

Tomoyuki Ichikawa

Takashi Inoue

Hidetada Tanaka

Takanori Namba

Toru Ito

Yukihiro Onoda

Atsushi Ozawa

Akitaka Kanamori

Yoshimasa Murata

Akio Shoji

Hiroki Fujimura

Takayuki Saito

Kaname Miyagishima

Ryota Fuwa

A substrate sheet () for a card-type lamp unit () includes the card-type lamp unit () which has a polygonal substrate body () having an outer peripheral side (to) and a connector forming side (), an external connector insertion portion () formed on the connector forming side (), a heat dissipation member () integrated with the substrate body () and having a linear expansion coefficient different from that of the substrate body (), and a light emitting element light source () connected to a control circuit () for light ON/OFF and a frame body () integrated with the card-type lamp unit () via a coupling end portion () formed on the outer peripheral side of the substrate body (), in which a coupling end portion () for the frame body () is provided on the connector forming side ().

Substrate sheet for card-type lamp unit, card-type lamp unit, and vehicle lamp

A lamp unit including a light emitting element, a lighting circuit, a substrate, and a heat dissipation member. The substrate includes a substrate main body, an external connector insertion portion, and a light emitting element installation portion, the heat dissipation member being provided in the substrate main body. The lighting circuit is mounted on the substrate main body, the lighting circuit being electrically connected with the light emitting element. The light emitting element is mounted on the substrate main body via the light emitting element installation portion, in a state of being in contact with the heat dissipation member.

Lamp unit

A semiconductor light source and a constant current circuit are arranged in series between an input terminal and a ground terminal. When an input voltage at the input terminal exceeds a predetermined threshold voltage, a load dump circuit cuts off or reduces a current that flows through the constant current circuit.

Vehicle lamp

A light-emitting module includes: a semiconductor light-emitting element; a circuit board on which a lighting control circuit configured to perform control to turn on and off the semiconductor light-emitting element is provided; and an element metal plate on which the semiconductor light-emitting element is mounted. The circuit board is a resin substrate in which a wiring portion connecting the semiconductor light-emitting element and the lighting control circuit is provided.

Light-emitting module

A light source unit includes a card type light source including a card substrate on which a light source is mounted, and a power supply connector configured to supply power to the light source. A card edge connector is formed on a part of the card substrate. The power supply connector is configured to be fitted to the card type light source via the card edge connector. The card type light source is provided with an alignment groove for confirming an alignment state with respect to the power supply connector.

Light source unit

A light source module has a heat radiating member that has heat radiating properties and has a through-hole penetrating therethrough, a heat generating component having a heat generating component main body disposed on a side of a first opening of the through-hole, and a pin terminal connected to the heat generating component main body and inserted through the through-hole, an electrically conductive member disposed on a side of a second opening of the through-hole and connected to the pin terminal protruding from the second opening, and a covering material that covers and fixes at least a portion of the electrically conductive member and the heat radiating member. A connection portion of the electrically conductive member with the pin terminal is not covered by the covering material.

Light source module and lamp using the same

Provided is a light emitting module in which an LED device is mounted and power is supplied to the LED device by a gold wire. The light emitting module includes a first resin (sealing material) that seals the gold wire and a second resin (dam wall) that surrounds at least a portion of the outer peripheral of the first resin. The first resin has a lower viscosity and a lower elastic modulus compared to the second resin, and protects the gold wire mechanically and chemically. The second resin suppresses the first resin from being flowed out toward the peripherals, and, as a result, the sealing state of the gold wire by the first resin may be maintained.

Light emitting module, method for manufacturing light emitting module, and vehicular lamp

In an automotive headlamp, a light-emitting module is configured such that a light-emitting element and a control circuit unit for controlling the lighting of the light-emitting element are structured integrally with each other. A control circuit unit in a position anterior to the light-emitting element in a lamp unit is located below a shade section so that the control circuit unit can be clear of the path of light used to form a low beam light distribution pattern of the light emitted by the light-emitting element. In this setting, the light-emitting element is so located that a main optical axis Axis perpendicular respect to an optical axis Axof the lamp unit and that a light-emitting portion of the light-emitting element protrudes higher than the control circuit unit in the direction of the main optical axis Ax

Automotive headlamp, heat radiating mechanism, light-emitting apparatus and light source fixing member

A light-emitting apparatus is provided with: a light-emitting module; a control circuit unit configured to control the lighting of the light-emitting module; a heat-radiating substrate configured to support the light-emitting module and the control circuit unit in such a manner as to recover the heat produced by the light-emitting module and the control circuit unit; and a connection support unit mounted on the heat-radiating substrate in such a state as to support an electrically conductive member by which to electrically connect the light-emitting module and the control circuit unit.

Light-emitting apparatus and automotive headlamps

A circuit module includes: a lighting control circuit that controls lighting of a semiconductor light emitting element; a first heat radiating member on which the lighting control circuit is mounted; a second heat radiating member that is separated from the first heat radiating member and has a surface on which the semiconductor light emitting element is mounted; and a connecting mechanism having both a housing that connects the first heat radiating member and the second heat radiating member together and a conductive portion that transmits a signal from the lighting control circuit to the semiconductor light emitting element. The housing is formed of a material having a coefficient of thermal conductivity lower than those of the first heat radiating member and the second heat radiating member.

Circuit module, light emitting module, and automotive lamp

A vehicle headlamp includes: a light-emitting module; a control circuit section for controlling a lighting of the light-emitting module; and a reflector including a reflecting face configured to reflect and collect light emitted from the light-emitting module. The control circuit section includes an opposing portion that is opposed to the reflecting face. The opposing portion is disposed at a position away from an optical path of light to be collected by the reflector.

Vehicle headlamp

An automotive headlamp is provided with: a light-emitting module; a control circuit unit configured to control the lighting of the light-emitting module; a support substrate configured to support both the light-emitting module and the control circuit unit; and a reflector configured to reflect, through an inner surface of the reflector, light emitted by the light-emitting module and collect the reflected light. The support substrate is arranged in a manner such that the control circuit unit is positioned in a region outside the reflector.

Automotive headlamps

In a light emitting module, a semiconductor light emitting element is mounted on a mounting board. A plated layer is provided on the surface of the mounting board so as to be electrically connected to the semiconductor light emitting element mounted on the mounting board. The plated layer has a power feeding portion and an element connection portion. The power feeding portion extends, of the surfaces of the mounting board, from the upper surface on which the semiconductor light emitting element is to be mounted to a stepped surface located below the upper surface, so that power can be fed, on the stepped surface, to the semiconductor light emitting element. The element connection portions are provided on the upper surface such that a plurality of the semiconductor light emitting elements mounted on the upper surface are connected together in series.

Growing community of inventors

Shizuoka, Japan

Tetsuya Suzuki