Fuji Electric Co., Ltd.

Kojin Co., Ltd.

Nippon Light Metal Company, Ltd.

Tetsuya Sunago

Yoshinari Ikeda

Michihiro Inaba

Hiromichi Gohara

Ryoichi Kato

Motohito Hori

Eiji Anzai

Yuki Inaba

Akihito Aoki

A cooling device includes a body having a flow passage for a heating medium that passes through the body, a first header made of a resin that has an inlet and covers a first end, and a second header made of a resin that has an outlet and covers a second end. The body has a front face, a back face, a first side face, and a second side face. The body and the first header are bonded to a first bonding face, a second bonding face, a third bonding face, and a fourth bonding face. The third bonding face is a curved surface that protrudes toward a +Y side. The fourth bonding face is a curved surface that protrudes toward a −Y side.

Heat exchanger having cured edge

A semiconductor device includes a base plate, a plurality of semiconductor units provided in parallel on the base plate, the plurality of semiconductor units implementing a pair, each semiconductor unit including a semiconductor chip and a rod-shaped unit-side control terminal, the unit-side control terminal being connected to the semiconductor chip, the unit-side control terminal extending opposite to the base plate; and an interface unit including a box-shaped accommodating portion, the accommodating portion being provided on the plurality of semiconductor units, the accommodating portion including an internal wiring and a rod-shaped external-connecting control terminal, the internal wiring being connected to each of the plurality of the unit-side control terminals extending from the plurality of semiconductor units, the external-connecting control terminal extending to the outside opposite to the semiconductor units, the external-connecting control terminal being connected to the internal wiring.

Semiconductor device, method for manufacturing semiconductor device, and interface unit

Growing community of inventors

Toyama, Japan

Tetsuya Sunago