Denso Corporation

Tetsuya Sueyoshi

Hiroaki Ando

Ichiro Yoshida

Kiyohiko Sawada

Tsubasa Kawashita

Tetsuichi Takeuchi

Kenichi Katoh

Keisuke Nishio

Kiminobu Inayoshi

Naoto Makino

An electronic device for a vehicle includes a substrate and a semiconductor package. The substrate is arranged to extend along a flowing path of wind produced by a fan unit. The semiconductor package is disposed on the substrate to be cooled by the wind. When an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area.

Electronic device for vehicle

A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.

An electronic device for a vehicle includes: a digital substrate having a first semiconductor package with a CPU, a second semiconductor package with a volatile memory readable and writable from the CPU, a third semiconductor package with a flash memory storing a start-up program of the CPU, and a fourth semiconductor package with a power supply management integrated circuit; and a fan that takes in air along the surface of the digital substrate on which the first to fourth semiconductor packages are mounted. The third semiconductor package is disposed to distance from the first semiconductor package by at least a first predetermined distance and to distance from the fourth semiconductor package by at least a second predetermined distance exceeding the first predetermined distance, and is disposed in a passage of the air taken in by the fan.

Growing community of inventors

Okazaki, Japan

Tetsuya Sueyoshi