Nissan Chemical Industries Limited

Nissan Chemical Corporation

Tetsuya Shinjo

Keisuke Hashimoto

Ryo Karasawa

Shunsuke Moriya

Yasunobu Someya

Hiroshi Ogino

Rikimaru Sakamoto

Hirokazu Nishimaki

Satoshi Takei

Kazuhiro Sawada

Takahisa Okuno

Takafumi Endo

Yasushi Sakaida

Hiroaki Okuyama

Tomoyuki Enomoto

Masakazu Kato

Takahiro Sakaguchi

Hiroto Ogata

Motohiko Hidaka

Kenji Takase

Daigo Saito

Hideki Musashi

Satoshi Kamibayashi

Yusuke Horiguchi

Takahiro Kishioka

Satoshi Takeda

Yuki Usui

Masaki Yanai

Takuya Fukuda

The invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (in the formula, L represents a substituent to the benzene ring, and each of a plurality of Ls represents a C1 to C4 alkyl group; and k represents the number of Ls and is an integer of 0 to 5) in an amount of 80 mass % or more.

Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition

A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.

Laminate peeling method, laminate, and laminate production method

A cleaning agent composition for use in removal of a polysiloxane adhesive remaining on a substrate, the composition containing a tetrahydrocarbylammonium fluoride and an organic solvent, wherein the organic solvent contains an aromatic compound represented by formula (1) and a lactam compound represented by formula (2). (in formulas (1) and (2), s represents the number of substituents Rs of the benzene ring and is 2 or 3; s groups of Rs each independently represent a C1 to C6 alkyl group; the total number of carbon atoms in s groups of C1 to C6 alkyl groups is 3 or greater; Rrepresents a C1 to C6 alkyl group; and Rrepresents a C1 to C6 alkylene group.)

Cleaning agent composition and cleaning method

A resist underlayer film-forming composition includes a resin; and a crosslinkable compound of Formula (1) or Formula (2): wherein the crosslinkable compound of Formula (1) or Formula (2) is a compound obtained by reacting a compound of Formula (3) or Formula (4): with an ether compound comprising a hydroxy group or a Calcohol.

Resist underlayer film-forming composition containing substituted crosslinkable compound

The invention provides a laminate having a first substrate formed of a semiconductor substrate; a second substrate formed of a light-transmissive support substrate; and an adhesive layer and a release layer disposed between the first substrate and the second substrate, characterized in that the release layer is a film formed from a releasing agent composition containing a polynuclear phenol derivative represented by formula (P) (wherein Ar represents an arylene group), a cross-linking agent, and at least one of an acid generator and an acid.

Multilayer object and release agent composition

A temporary adhesive has excellent spin coating properties of a circuit side of a wafer and a support, and excellent heat resistance when the circuit side of the wafer or the support is attached to an adhesion layer or a rear surface of the wafer is processed, and is capable of easily separating the circuit side of the wafer from the support after polishing the rear surface of the wafer, and simply removing an adhesive attached to the wafer or the support after the separation. The adhesive contains a component (A) to be cured by a hydrosilylation reaction, and a component (B) containing an epoxy-modified polyorganosiloxane at a ratio in % by mass of the component (A) to the component (B) of 99.995:0.005 to 30:70. The component (B) is an epoxy-modified polyorganosiloxane having an epoxy value of 0.1 to 5.

Temporary adhesive containing epoxy-modified polysiloxane

An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, characterized in that the adhesive composition contains an adhesive component (S) and a light-absorbing organic compound (X); and the light-absorbing organic compound (X) contains, in the molecule thereof, one or more aromatic rings, one or more rings each containing a heteroatom forming the ring, and one or more groups selected from among a carbonyl group and a thiocarbonyl group.

Adhesive composition for peeling off by irradiation with light, layered product, and production method and peeling method for layered product

A cleaning agent composition for use in removal of a polysiloxane adhesive remaining on a substrate, the composition containing a tetrahydrocarbylammonium fluoride and an organic solvent, wherein the organic solvent contains an alkylene glycol dialkyl ether and a lactam compound represented by formula (1). (in formula (1), Rrepresents a C1 to C6 alkyl group, and Rrepresents a C1 to C6 alkylene group.)

An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner, the composition containing a component (A) which is cured through hydrosilylation and a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane, wherein the component (A) contains a polysiloxane (A1) including a siloxane unit represented by SiO(unit Q) and the like, and a platinum group metal catalyst (A2); and the polysiloxane (A1) contains a polyorganosiloxane (a1) including a siloxane unit represented by SiO(unit Q') and the like, and a polyorganosiloxane (a2) including a siloxane unit represented by SiO(unit Q&#x2033;) and the like, and having a functional group (Si&#x2014;H) content of 5.0 mol/kg or greater.

Adhesive agent composition, layered product and production method for layered product, and method for reducing thickness of semiconductor forming substrate

A cleaning agent composition for use in removing an adhesive residue, characterized in that the composition contains a quaternary ammonium salt and a composition solvent including a first organic solvent and a second organic solvent; the first organic solvent is an amide derivative represented by formula (Z) (wherein Rrepresents an ethyl group, a propyl group, or an isopropyl group; and each of Rand Rrepresents a C1 to C4 alkyl group); the second organic solvent is a non-amide organic solvent other than the amide derivative; and the composition has a water content less than 4.0 mass %.

Cleaning agent composition comprising an alkylamide solvent and a fluorine-containing quaternary ammonium salt

There is provided resist underlayer film for lithography process with high dry etching resistance, wiggling resistance, and heat resistance. Resist underlayer film-forming composition for lithography including polymer having unit structure of Formula (1): wherein A is hydroxy group-substituted Carylene group derived from polyhydroxy aromatic compound; B is Carylene group or Cheterocyclic group containing nitrogen atom, oxygen atom, sulfur atom, or combination thereof; Xis H, NH, primary ammonium ion, secondary ammonium ion, tertiary ammonium ion, or quaternary ammonium ion, T is hydrogen atom, Calkyl group or Caryl group that may be substituted with halogen group, hydroxy group, nitro group, amino group, carboxylate ester group, nitrile group, or combination thereof as substituent, or Cheterocyclic group containing nitrogen atom, oxygen atom, sulfur atom, or combination thereof, B and T may form Cring together with carbon atom to which they are bonded. 

Resist underlayer film-forming composition comprising carbonyl-containing polyhydroxy aromatic ring novolac resin

A laminated body for polishing a back surface of a wafer, the laminated body including an intermediate layer that is disposed between a support and a circuit surface of the wafer and peelably adheres to the support and the circuit surface, wherein the intermediate layer includes an adhesion layer in contact with the wafer and a peeling layer in contact with the support, and the peeling layer contains a novolac resin that absorbs light with a wavelength of 190 nm to 600 nm incident through the support, resulting in modification. The light transmittance of the peeling layer at a wavelength range of 190 nm to 600 nm may be 1 to 90%. The modification caused by absorption of light may be photodecomposition of the novolac resin.

Laminated body including novolac resin as peeling layer

An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.

Temporary adhesive containing phenyl group-containing polysiloxane

An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.

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Toyama, Japan

Tetsuya Shinjo