Sumitomo Electric Printed Circuits, Inc.

Sumitomo Electric Industries, Limited

Sumitomo Electric Fine Polymer, Inc.

Tetsuya Shimomura

Masahiko Kouchi

Yoshio Oka

Makoto Nakabayashi

Kazuyuki Maeda

Jinjoo Park

Narito Yagi

Junichiro Nishikawa

A printed circuit board according to an embodiment of the present invention includes, alternately, at least one insulating layer containing a synthetic resin as a main component; and a plurality of conductive layers including circuit patterns, wherein the plurality of circuit patterns of the plurality of conductive layers form a spiral pattern in plan view, and the plurality of circuit patterns are connected together via a plurality of through-holes so as to form a single closed loop in which a current flows counterclockwise or clockwise in an entirety of the spiral pattern. The conductive layers are preferably formed on both surfaces of the at least one insulating layer so as to form a pair. The spiral pattern includes a plurality of multi-row circuits arranged to form multi-rows, and a bridging circuit that connects an end portion of one multi-row circuit of one of the conductive layers to an end portion of another multi-row circuit of the other conductive layer, the other multi-row circuit being adjacent to the one multi-row circuit.

Printed circuit board, antenna, and wireless charging device

Wiring board

The printed wiring boardincludes the metallic substrate, the insulating layerprovided on the surface of the metallic substrate, and the conductive layerformed on the surface of the insulating layer. The conductive layeris electrically connected to the metallic substrate. A bottomed via hole or a through holeis formed in the insulating layerand the conducive layer. The via hole has a bottom in the metallic substrate, and has a wall surface in the insulating layerand in the conductive layer. The through holeextends through the insulating layer, the conductive layer, and the metallic substrate. Conductive pastefills the bottomed via hole or the through holeto electrically connect the metallic substrateand the conductive layerwith each other. The printed wiring boardis subjected to a process in which current is applied to the interface between the metallic substrateand the conductive paste

Printed wiring board and method for manufacturing the same

Growing community of inventors

Kouga, Japan

Tetsuya Shimomura