Canon Kabushiki Kaisha

Ulvac, Inc.

Tetsuya Shimada

Katsumi Komiyama

Makoto Ogura

Satoshi Itabashi

Hiroo Ichihashi

Masashi Kitani

Osamu Hamamoto

Takao Yonehara

Noriyuki Kaifu

Toshihiro Saika

Masayoshi Murata

Yoshikazu Sano

Tadao Endo

Katsunori Hatanaka

Tomokazu Dainobu

Toyoki Matsushima

Kiyofumi Sakaguchi

Isao Kobayashi

Kazuaki Ohmi

Kunio Watanabe

Katsunori Terada

Hideyuki Odagi

Koji Takahashi

Takeshi Miyazaki

Shigetoshi Sugawa

Hideyuki Suzuki

Takeshi Ichikawa

Kazuaki Tashiro

Katsumi Kurematsu

Tatsundo Kawai

Masanori Takahashi

Hiroshi Takabayashi

Katsuhiko Yamada

Osamu Yuki

Hisanori Tsuda

Takayuki Ishii

Yoshinobu Sekiguchi

Yoshihiro Onitsuka

Masahiro Okuda

Toshiaki Itazawa

Makoto Uehara

Kazuya Ijuin

Shigeki Yabu

Masahiro Matsumoto

Makoto Koto

Masashi Kubo

Kouichi Hanzawa

Yasushi Maeda

Takafumi Matsumoto

Manabu Harada

Kenji Morimoto

Kumiharu Takai

Hiromi Kodama

Takashi Kageyama

Susumu Ikeda

Mineharu Moriya

Yuu Nakamuta

Minoru Dogi

Shun Mikami

According to a mode of the present invention, a method of manufacturing an electronic component includes: preparing a component main-bodyincluding a first surface having an electrode-formed region having a plurality of bump electrodes, a second surface opposite to the first surface, and side peripheral surfaces connecting the first surface and the second surface; forming a mask section Mon at least a peripheral portion of the first surface, the mask section surrounding the electrode-formed region, a height of the mask section being equal to or more than a height of the plurality of bump electrodes; bonding the mask section of the first surface to an adhesive layeron a holder for holding a component; forming a protective filmon the component main-body, the protective film covering the second surface and the side peripheral surfaces; and removing the mask section Mfrom the first surface.

Method of manufacturing an electronic component and processing system

A thin film forming apparatus such that a substrate can be easily fixed/removed to/from the outer circumferential surface of a drum type substrate holder through a simple arrangement. The drum type substrate holder () is supported in a horizontal posture rotatably about a horizontal rotational shaft in a film deposition chamber A jig () holding a substrate () fixedly is transferred by an arm horizontally onto the outer circumferential surface of the drum type substrate holder (), and an end part () of the substrate fixing jig () can be secured by a securing device () provided at the corner part () of the outer circumferential surface of the drum type substrate holder ().

Thin film forming apparatus

There is provided a film forming apparatus which is capable of forming a film on both surfaces of a substrate by sputtering continuously with high efficiency by restraining a rise in temperature of the substrate to a predetermined value or higher. In a film forming chamberthe pressure of which is controlled, while a rotating drumis rotated by the driving of a drive motor, a film is formed on the top surface of a substrateon a substrate trayheld on a substrate holderby cathodesandfor outer surface to which a d.c. voltage or an a.c. voltage or a high-frequency voltage is applied, and also a film is formed on the back surface of the substrateon the substrate trayheld on the substrate holderby cathodesandfor inner surface to which a d.c. voltage or an a.c. voltage or a high-frequency voltage is applied, by which a high-quality film is formed on both surfaces of the substrateby sputtering continuously with high efficiency by restraining a rise in temperature of the substrate to a predetermined value or higher.

Film forming apparatus

This invention provides a semiconductor film manufacturing method using a new separation technique and applications thereof. The semiconductor film manufacturing method of this invention includes a separation layer forming a step of hetero-epitaxially growing a separation layer () on a seed substrate (), a semiconductor film forming step of forming a semiconductor film () on the separation layer (), and a separation step of separating, by using the separation layer (), the semiconductor film () from a composite member (Ia) formed in the semiconductor film forming step.

Semiconductor film manufacturing method and substrate manufacturing method

Provided is a non-single-crystal germanium thin film transistor having a gate insulating film capable of reducing the interface state density between an active layer and the gate insulating film. This thin film transistor has an active layer made of a non-single-crystal germanium film, and a gate oxide film substantially made of zirconium oxide or hafnium oxide.

Thin film transistor and method of fabricating the same

A process for manufacturing a semiconductor wafer which has superior suitability for mass production and reproducibility. The process comprises the steps of preparing a first member which has a monocrystalline semiconductor layer on a semiconductor substrate with a separation layer arranged therebetween with a semiconductor wafer as the raw material, transferring the monocrystalline semiconductor layer onto a second member which comprises a semiconductor wafer after separating the monocrystalline semiconductor layer through the separation layer, and smoothing the surface of the semiconductor substrate after the transferring step so as to be used as a semiconductor wafer for purposes other than forming the first and second members.

Method of manufacturing semiconductor wafer method of using and utilizing the same

A method of producing a semiconductor member comprises a first step of preparing a first member having a non-porous layer on a semiconductor substrate, and a second step of transferring the non-porous layer from the first member onto a second member, wherein use of the semiconductor substrate from which the non-porous layer is separated in the second step as a constituent material of the first member in the first step is conducted (n&minus;1) times (&ldquo;n&rdquo; is a natural number not less than 2), the first and second steps are repeated n times, the semiconductor substrate is separated in n-th use in the second step and the separated semiconductor substrate is used for an use other than that of the first and second steps.

Method of producing semiconductor member

Disclosed herein is a process for producing a color liquid crystal display device, which comprises the steps of forming a plurality of switching elements on a first transparent substrate; providing a coating layer on the plural switching elements; separately applying curable inks to predetermined opening areas between the switching elements by an ink-jet system to form a color filter; forming a transparent electrode on the color filter; forming a transparent electrode on a second transparent substrate; and charging a liquid crystal into a space between the first and second transparent substrates.

Production process of color liquid crystal display device

An image sensor includes a photoelectric conversion unit, a charge storage unit, a switch unit, and a wiring unit, all of which are formed on a single substrate. A capacitor of the charge storage unit is formed at the same substrate position as that of a pattern of said wiring unit.

Photoelectric converter

A display apparatus includes a display unit for displaying images, a backlight unit disposed behind the display unit for illuminating the display unit, an inverter unit for electrically controlling the backlight unit, a controller unit for controlling the inverter unit and the display unit, and a power supply unit having an exothermic heat distribution for supplying electricity to the inverter unit and the controller unit. The inverter unit and controller unit are disposed behind the backlight unit and the power supply unit is disposed on a side of the display unit, backlight unit, inverter unit and controller unit. The display unit, backlight unit, inverter unit, controller unit and power supply unit are disposed in a common housing. The inverter unit and the controller unit are arranged behind the backlight unit. An insulating member is further disposed between the power supply unit and the display unit at a position corresponding to a region of relatively large exothermic heat of the power supply unit, and the insulating member is disposed at a diagonal position with respect to the inverter unit. The display apparatus may be supported by a support structure including vertically tilting and laterally turning mechanisms.

Display apparatus

An image reading device for reading image information of an original with reading means, includes: original pressing means including a flexible sheet, a flexible member for pressing the flexible sheet, and means for pressing the flexible member.

Image reading device

In an original image reading device of this invention, a reading unit for reading an image on an original, an original convey unit for conveying the original, and a drive force transmission unit for transmitting a drive force from an apparatus main body to the original convey unit are integrally arranged on single support unit, so that the device is attachable to and detachable from said apparatus main body.

Image reading device and image information processing apparatus

A method of producing an optical device, includes the steps of forming a space between an optical member and a first mold and a second mold by arranging the optical member between the first mold and the second mold, at least either the first or second mold is arranged to touch one surface of the optical member. A resin member is injected through an injection port provided with the first or second mold in the formed space.

Method of producing a photoelectric converting device

An original image reading device includes a first supporting device having an original platen roller, provided on a side of an original opposed to an image reading device, for conveying the original at a position deviated from an original reading position, and a non-cylindrical original contact device for urging the original toward the image reading device. The original contact device is provided at the original reading position on the side of the original opposed to the image reading device. A second supporting device includes the image reading device, which has a contact-type reading sensor. The image reading device reads image information of the original by receiving a light reflected from the original. The first supporting device and the second supporting device are combined at a fulcrum at an original exit side so as to relatively rotatable. The original platen roller is separated from the second supporting device upon relative rotation of the first and second supporting devices.

Original image reading apparatus having device for conveying an original

In an original image reading device of this invention, a reading unit for reading an image on an original, an original convey unit for conveying the original, and a drive force transmission unit for transmitting a drive force from an apparatus main body to the original convey unit are integrally arranged on single support unit, so that the device is attachable to and detachable from the apparatus main body.

Image reading device detachable from main body

Growing community of inventors

Zama, Japan

Tetsuya Shimada