Nitto-denko Corporation

Tetsuya Oosawa

Mitsuru Honjo

Naoyuki Tanaka

Daisuke Yamauchi

Hitoki Kanagawa

Yasuhito Funada

Masami Inoue

A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.

Method for manufacturing printed circuit board

A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.

Printed circuit board and method of manufacturing the same

A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.

A suspension board with circuit having a conductor layer formed in the form of a fine wiring circuit by an additive process, while providing a reduced risk of damage and breaking of the conductor layer in a flying lead portion. The suspension board with circuit comprises a supporting board, an insulating base layerformed on the supporting board, a conductor layerformed on the insulating base layer, an insulating cover layerformed on the conductor layer, and a flying lead portionin which a supporting-board-side opening, a base-layer-side opening, and a cover-layer-side openingare formed so that both sides of the conductor layercan be exposed therefrom. A reinforcing portionorfor reinforcing the conductor layerformed continuously from at least either of the insulating base layerand the insulating cover layeralong the longitudinal direction of the conductor layeris included in the flying lead portion

Growing community of inventors

Ibaraki, Japan

Tetsuya Oosawa