Hitachi Global Storage Technologies Netherlands B.v.

Hgst Netherlands, B.v.

Tetsuya Nakatsuka

Satoshi Kaneko

Akihiko Aoyagi

Takashi Kouno

Hitoshi Shindo

Teruhiro Nakamiya

Masahiko Katoh

Tetsuya Nakamura

Takahiro Sakai

Yasushi Inoue

Masashi Okubo

A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal-joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal-joining.

Manufacturing method for a head-stack assembly, apparatus for interconnection of the head-stack assembly, and head-stack assembly

Embodiments of the present invention help to achieve a solder joining structure having high reliability, in which even if a componential material of a flange of a feed-through of a sealed magnetic disk drive is an iron-based material such as Kovar&#x2122;, and a componential material of a base of the drive is an aluminum-based alloy, leakage of low-density gas is dramatically reduced. According to one embodiment, a base has a stepped portion in the inside of a periphery of an opening, and an inclined surface extending to the outside of the base is formed at an edge of a surface of the stepped portion, on which a flange of a feed-through is placed, thereby when the stepped portion of the base is joined by soldering with the flange of the feed-through, a solder fillet is formed not only in the inside of the base, but also in the outside thereof.

Magnetic disk drive feed-through solder connection with solder fillet formed inside base and protruding outside base

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Kanagawa, Japan

Tetsuya Nakatsuka