Tanaka Kikinzoku Kogyo K.k.

Mabuchi Motor Co., Ltd.

Hgst Netherlands, B.v.

Nec Platforms, Ltd.

Biglobe Inc.

Tetsuya Nakamura

Toshiya Yamamoto

Isao Shibuya

Takao Asada

Nobuhito Yanagihara

Sachihiro Nishide

Masahiro Takahashi

Satoshi Kaneko

Nobuyuki Enomoto

Keiji Nakamura

Osamu Sakaguchi

Masahiko Katoh

Takahiro Sakai

Osamu Matsuzawa

Hiroyuki Kusamori

Kiyoshi Nakama

Tetsuya Nakatsuka

Masashi Okubo

Hiroyuki Itakura

Daisuke Someya

Hiroki Fukasawa

Yasushi Inoue

A DC high-voltage relay with at least one contact pair including a movable contact and a fixed contact, the contact pair having a contact force and/or an opening force of 100 gf or more, having a rated voltage of 48 V or more, the movable contact and/or the fixed contact includes a Ag oxide-based contact material. Metal components contain at least one metal M essentially containing Zn, and a balance being Ag and inevitable impurity metals, and the contact material has a content of the metal M of 0.2% by mass or more and 8% by mass or less based on a total mass. The contact material has a material structure in which one or more oxides of the metal M having an average particle size of 0.01 μm or more and 0.4 μm or less are dispersed in a matrix including Ag or a Ag alloy.

DC high-voltage relay, and contact material for DC high-voltage relay

A DC high-voltage relay including at least one contact pair including a movable contact and a fixed contact, having a contact force and/or opening force of 100 gf or more, the DC high-voltage relay of 48 V or more. The movable contact and/or the fixed contact includes Ag oxide-based contact material. Metal components in the contact material includes at least one metal M essentially containing Sn, and a balance including Ag and inevitable impurity metals. The content of the metal M is 0.2% by mass or more and 8% by mass or less based on the total mass of all metal components in the contact material. The contact material has a material structure in which one or more oxides of the metal M are dispersed in a matrix including Ag or a Ag alloy. As metal M, In, Bi, Ni and Te can be added.

DC high voltage relay and contact material for DC high-voltage relay

According to an exemplary embodiment, a communication management system has an access point that controls the connection of a terminal trying to connect through wireless communication, and a communication management device that manages a plurality of said access points are connected to each other via a network.

Communication management system, access point, communication management device, connection control method, communication management method, and program

A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal-joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal-joining.

Manufacturing method for a head-stack assembly, apparatus for interconnection of the head-stack assembly, and head-stack assembly

An object of the present invention is to provide a method of producing an Ag&mdash;ZnO electric contact material which can uniformly disperse ZnO micrograms in Ag; which maintains low contact resistance; which exhibits enhanced welding resistance and wear resistance; and which is suitable in view of production costs. The method of producing an Ag&mdash;ZnO electrical contact material comprises casting Ag and Zn at predetermined proportions and subjecting the resultant Ag&mdash;ZnO alloy to internal oxidation so as to disperse ZnO in Ag, the method being characterized in that an Ag&mdash;Zn alloy comprising 5-10 wt. % (as reduced to weight of metal) Zn, the balance being Ag, is formed into chips; the chips are subjected to internal oxidation; the internally oxidized chips are compacted to thereby form billets; the billets are pressed and sintered; and subsequently, the sintered billets are extruded, to thereby yield uniform dispersion, in Ag, of ZnO micrograms.

Method for preparing Ag-ZnO electric contact material and electric contact material produced thereby

An Ag--Cu alloy for a sliding contact containing:

Ag-Cu alloy for a sliding contact

Sliding contact material, clad compoosite material, commutator employing

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Kanagawa, Japan

Tetsuya Nakamura