Sony Semiconductor Solutions Corporation

Tetsuya Nakagawa

Shinichi Yuzuki

Kazumi Kobayashi

Shunichiro Shibazaki

Kiyohiro Saito

Nobuyuki Watanabe

Yuta Shishido

Masaki Hoshino

The present disclosure relates to a camera module and an electronic device that can improve heat dissipation. A movable member has an image sensor on a front side and is movable in a direction along an imaging surface of the image sensor, the fixed member is fixed with a predetermined gap interposed between the fixed member and the movable member on a back side of the movable member, and at least one heat dissipating member is fixed to at least one of the fixed member and the movable member and is in contact with the other in the gap. The present disclosure is applicable to a camera module of a sensor-shift system.

Camera module and electronic device with heat dissipating member

Growing community of inventors

Kanagawa, Japan

Tetsuya Nakagawa