Fujitsu Corporation

Tetsuya Murayama

Hiroshi Kadoya

Junichi Hayama

Hiroyuki Abe

Kiyonori Kusuda

Kenji Toshimitsu

Fujio Ozawa

Kenji Tsutsumi

Yuichi Sato

Tetsuya Takahashi

Tsutomu Takahashi

Hisao Hayashi

Naoya Yamazaki

Takashi Shirakami

Kenji Joko

Koichi Nakamura

Kazuhiro Iino

Tomoyuki Hongoh

Mitsuo Kaetsu

Yasuko Nozu

Yoshiaki Tada

Hiroshi Yamaji

Hisato Sato

Kazuaki Kashiwada

Yusuke Kira

Kouichi Namimatsu

Shigeru Amagasa

Kenji Joukou

Satoshi Tojo

Noburo Nakama

Mayumi Nakamura

With respect to a housing device having a plurality of slots in which plug-in units are mountable, division plates corresponding to the positions of the openings of the slots are put in the inside of a baffle section for changing the direction of the flow of cooling air released from the slots, and the division plates are used to divide the inside space of the baffle section into a plurality of regions corresponding to the slots, thereby reducing mutual interference of the cooling air from the slots in the baffle section and preventing a further increase in differences in the amount of passing air among the slots. Thereby, even if any difference occurs in the amount of passing air among the slots due to a structural factor, it is possible to reduce the deterioration of the cooling capacity of a slot through which relatively less amount of air passes.

Cooling structure for housing device

A modular plug attaching and detaching tool includes a first holder configured to accommodate a plurality of modular plugs in an aligned state and a second holder configured to press unlocking claws of the plurality of modular plugs when the second holder is attached to the first holder. The first holder includes an engagement groove extending in an inserting direction of the modular plug. The second holder includes an engagement part configured to engage with the engagement groove of the first holder by being moved in the inserting direction.

Tool and method for attaching and detaching modular plugs

A communication apparatus which occupies small space and yet can be connected with numerous external cables and which permits a cooling arrangement to be constructed at low cost. An information processing device constituting the communication apparatus has external cable connection ports provided on both top and bottom surfaces thereof, and thus, more external cables can be connected than in the case of connecting the cables to the side surfaces. Also, the external cables connected to the ports are guided along the top and bottom surfaces toward the front of the communication apparatus with their heights restricted by external cable covers and, therefore, do not occupy substantial space above and below the device. Further, since the external cables are connected to the top and bottom surfaces, the front and rear surfaces of the device have spare space, making it possible to construct a ventilation arrangement such as vent holes and fans.

Communication apparatus, information processing device, and external cable connection method

A cooling structure for electronic equipment including a plurality of electronic devices superposed on each other, each of the electronic devices having a lower part where an air ventilation part configured to ventilate air so as to cool the electronic device is provided, the cooling structure includes an air intake and exhaust hole forming part which is formed at an upper part of a first one of the electronic devices and below the air ventilation part of a second one of the electronic devices provided on the first electronic device. Air outside of the electronic equipment is taken into an inside of the second electronic device or air inside of the first electronic device is exhausted to the outside of the electronic equipment via the air intake and exhaust hole forming part, so that an amount of the air ventilated inside of the first electronic device is controlled.

Cooling structure and cooling method for electronic equipment

A power supply terminal that prevents damage to capacitors included in a noise filter circuit therein which may occur due to a BWB's warp or thermal stresses at soldering time. The noise filter circuit is formed on a noise filter circuit substrate, being a substrate separate from the BWB. The noise filter circuit substrate is connected conductively to part of each of press fit terminals.

Power supply terminal and back board

There is provided a circuit board cabinet which is capable of more reliably preventing flames of a fire in a shelf from spreading to external devices, without degrading cooling capability thereof. Flames of the fire occurring in the shelf rise within a slot, pass through a shield plate, and then enter a heat shield unit. In the heat shield unit, the flames are first blocked by a heat shield plate and substantially reduced in force while passing through holes formed through the heat shield plate. Portions of the flames which were not blocked by the heat shield plate reach a top board of the unit after passing through the holes, where they are reduced. Since there is a predetermined distance between the heat shield plate and the top board, the flames having passed through the heat shield plate spread horizontally to some extent and then reach the top board. Therefore, it is possible to reduce the force of the flames sufficiently by the top board. The flow of cooling air in normal use is sufficiently slower than that of flames, so that there is no fear of the existence of the heat shield unit causing a degraded heat dissipation.

Circuit board cabinet

An optical telecommunication apparatus includes a shelf, a primary substrate provided in the shelf, a secondary substrate provided on the primary substrate, an optical component provided on the secondary substrate, and an optical connector provided on the secondary substrate for connection with an external optical cable, wherein the secondary substrate is pivoted on the primary substrate about a pivot axis so as to be movable about the pivot axis between a first position in which the secondary substrate is inside said shelf and a second position in which the secondary substrate projects outside of the shelf. The secondary substrate is in electrical connection with the primary substrate while in any position between the first and second positions.

Optical telecommunication apparatus

This invention relates to a subrack device applicable for an SDH network, and more particularly to a subrack device which can be produced flexibly in response to a customer's need. The subrack device has a subrack body commonly used regardless of a type of the subrack device. The subrack body has a circuit-board-unit housing portion and an outer-connecting-board mounting portion. Circuit boards and outer-connecting-board connecting-boards of different types are prepared. The outer-connecting-board mounting portion has a plurality of outer-connecting-board mounting territories. The outer-connecting-boards are plugged in the outer-connecting-board mounting territories to produce the subrack device meeting the customer's need.

Subrack device

Growing community of inventors

Kawasaki, Japan

Tetsuya Murayama