Ibiden Company Limited

Tetsuya Muraki

Shinobu Kato

Haruhiko Morita

Hisashi Kato

Toshihiko Yokomaku

Hitoshi Miwa

Takahisa Hirasawa

Takayuki Furuno

Kiyotaka Tsukada

Atsunari Yamashita

Yoshitomo Tomida

Yasuji Hiramatsu

Yukinobu Mikado

Katsumi Sagisaka

Katsuo Kawaguchi

Yuki Terada

A motor coil substrate includes a flexible substrate, and coils formed on the flexible substrate. The flexible substrate is wound N times where N is 2 or larger, the coils are formed in a multiple of 3, the flexible substrate includes a first flexible substrate and a second flexible substrate extending from the first flexible substrate and wound around the first flexible substrate, the flexible substrate has a first end and a second end on an opposite side with respect to the first end such that the first flexible substrate has a first end of the flexible substrate, the second flexible substrate is positioned on an outer side of the first flexible substrate, and the coils are formed such that a coil or coils formed on the first flexible substrate partially overlap with a coil or coils formed on the second flexible substrate.

Motor coil substrate comprising flexible substrate and coils and motor formed thereof

A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.

Planar transformer

A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate such that the coils are positioned substantially in a row between the first end and second end of the flexible substrate. The coils are formed such that the number of coils is K and that the coils include the first coil positioned close to the first end and the K-th coil positioned to form a predetermined distance between the K-th coil and the second end, where K is an integer equal to or greater than 2.

Coil substrate and motor coil substrate

A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.

A coil substrate includes a flexible substrate having first and second ends, a first coil formed on first surface of the substrate such that the first coil has center space and first wiring surrounding the space, and an second coil formed on second surface of the substrate such that the second coil has center space and second wiring surrounding the space and is positioned directly below the first coil. Each of the first and second wirings has outer and inner ends such that each wiring is formed in spiral shape between the outer and inner ends, a number of turns in the first coil is greater than a number of turns in the second coil, a width of the first wiring is substantially constant from the outer end to the inner end, and a width of the second wiring is not constant from the outer end to the inner end.

Coil substrate, motor coil substrate, and motor

A motor coil substrate includes a coil substrate that is wound in a cylindrical shape and includes a flexible substrate and coils formed on the flexible substrate such that the flexible substrate has a first end and a second end on an opposite side with respect to the first end and that the coils are arrayed from the first end to the second end of the flexible substrate. The coils are formed such that each of the coils has a central space and includes wirings surrounding the central space, and the flexible substrate has openings formed such that each of the openings is penetrating through the flexible substrate and positioned in the central space of a respective one of the coils.

Motor coil substrate and motor

A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.

A coil substrate for a motor includes a flexible substrate, and multiple coils formed on a surface of the flexible substrate. Each of the coils has a wiring having first wiring portions and second wiring portions extending from the first wirings respectively and is formed such that the first wiring portions extend parallel with respect to each other and that the second wiring portions extend not parallel to the first wirings, and the flexible substrate is formed to be formed around a magnet of a motor such that the first wiring portions form an angle that is substantially perpendicular to a rotation direction of the motor.

Motor coil substrate, motor, and method for manufacturing motor coil substrate

A coil substrate includes a flexible substrate, and a coil including a wiring and formed on the flexible substrate. The flexible substrate has a cut penetrating through the flexible substrate such that the cut is formed to extend along a portion of the coil.

Coil substrate, laminated coil substrate, motor coil substrate, and motor

A motor coil substrate includes a flexible substrate, and multiple coils formed on the flexible substrate such that each of the coils has a spiral shape. The flexible substrate has multiple folding lines formed and the multiple coils positioned such that the flexible substrate is folded at the folding lines and wound around a magnet and that an m-th coil and an (m+1)-th coil of the coils partially overlap one another when folded at the folding lines.

Motor coil substrate and method for manufacturing motor coil substrate

A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties.

Printed wiring board, electronic device, and printed wiring board manufacturing method

A circuit board comprises a first conductive post for electrically connecting to the first electrode of the semiconductor device, a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to the second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to the third electrode of the semiconductor device, and a third metal plate connecting to the third conductive post.

Circuit board and semiconductor module

A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion.

Semiconductor device and fabrication method therefor

The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the second end being connected to the semiconductor element and the conductor posts being connected to the support plate at a position on the side of the second end that is closer to the first end, wherein the conductor posts have a heat conductivity of approximately 200 W/m&#xb7;K or higher and a Vickers hardness of approximately 70 or lower.

Semiconductor device and production method thereof

A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, conductor circuit provided on the insulative base material and a cover lay to cover the conductor circuit, the rigid and flexible substrates being connected to each other. As the insulative base material of the flexible substrate, there is adopted a bendable base material formed by impregnating a glass cloth with a resin and drying it. An conductor circuit is formed on one side of the flexible substrate while a dummy pattern is formed on the other side near a portion thereof where the flexible substrate is to be bent. Thus, the proposed flex-rigid printed wiring board is excellent in connection reliability, permitting to prevent the base material from being easily deformed near the bending portion, conductor circuit from being broken and the flexible substrate from being waved. The similar effect can also be attained with the wiring patterns of the conductor circuit on the flexible substrate being formed wide or curved in the width direction at the bending portion.

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Ogaki, Japan

Tetsuya Muraki