Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Tetsuya Morinaga

Toshimi Kaneko

Takaomi Toi

Tetsuo Hatakenaka

Shinya Hirai

Takahiro Azuma

Masahiro Bando

Yu Ishiwata

Koki Sasaki

Yasushi Saito

Yoshie Nishikawa

Takahiro Aoki

Takayuki Hirotsuji

Kazuo Kasahara

Yoshimasa Goto

Keiji Sakata

Ryuichi Fujinaga

Atsuo Senda

Hideyuki Mihara

Satoshi Murata

Toshi Numata

Yoshio Hanato

Kiyomi Sasaki

Hideyuki Kashio

Kiyoshi Nakano

Yukio Hata

Hidekazu Kato

Shinji Wakamatsu

Kazuya Nishimura

A wire-wound core includes a core portion extending in a longitudinal direction, first and second flange portions respectively disposed at first and second end portions of the core portion in the longitudinal direction, and at least one terminal electrode disposed at each of the first and second flange portions. When a face to be oriented toward a mount board and a face of the first flange portion facing an outer side are respectively called a bottom surface and an outer end surface, the outer end surface has a recessed portion that reaches the bottom surface. The terminal electrode disposed at the first flange portion includes a bottom surface electrode portion formed of a film conductor extending along the bottom surface of the first flange portion and an end surface electrode portion formed of a conductor filling the recessed portion and being in contact with the bottom surface electrode portion.

Wire-wound core, wire-wound core manufacturing method, and wire-wound-equipped electronic component

A wire wound-type coil component with an integrated structure does not have a bonding portion where there is concern about reliability with respect to a spiral conductive wire, a terminal electrode, and an annular core. A coil component includes a core with an integrated structure, at least part of which is a winding core portion, which has an annular shape having a through-hole, and which is made of a non-conductive material; and a coil conductor with an integrated structure, which has a spiral conductive wire arranged to spirally extend around the winding core portion and first and second terminal electrodes formed at both end portions of the spiral conductive wire, respectively. The coil component is manufactured through three-dimensionally shaping the core, the coil conductor, and a shape holding member for holding a shape of a wall surface of the core defining the through-hole, by using a 3D printer.

Coil component and manufacturing method therefor

A common-mode choke coil includes a core, external electrodes, a pair of wires, and a top plate. The core includes a winding core portion and a pair of flanges at both ends of the winding core portion. The upper surface of the winding core portion and the upper surfaces of the flanges are covered with a metal film. The external electrodes are provided on lower portions of the flanges. A pair of wires are wound on the winding core portion of the core, and the ends of the wires are connected to the external electrodes. The top plate is bonded to the upper surfaces of the flanges preferably via an adhesive.

Common-mode choke coil

A common-mode choke coil has induction immunity characteristics that are improved by a coil structure preventing a transmitter IC and a receiver IC from malfunctioning during an induction immunity test and which controls a decrease in ESD resistance and a decrease in self-resonance frequency. The common-mode choke coil includes a core, external electrodes, a pair of coils, and a top plate. The core includes a core section and a pair of flange sections. The pair of coils are wound around the core section of the core, and the ends of the coils are connected to the external electrodes, respectively. An underside and a side surface of the top plate are plated with a metal film, and bonded to the top surfaces of the flange sections preferably by an adhesive agent. The metal film is segmented into two separate portions so as to define two separate metal sections with a gap therebetween so that the metal sections are electrically disconnected.

A common mode choke coil includes a core, external electrodes, a pair of windings, and a top plate. The core includes a winding core portion and a pair of flanges disposed at respective ends thereof. The external electrodes are provided at lower portions of the flanges. The pair of the windings is wound around the winding core portion of the core, and ends thereof are connected to the external electrodes, respectively. A lower surface and a side surface of the top plate are covered with a metal film and are adhered to upper surfaces of the flanges with an adhesive. Preferably, magnetic powder is mixed in the adhesive.

Common mode choke coil

An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag&mdash;Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

Electronic device having electric wires and method of producing same

An electronic component is constructed to prevent Cu elution to a solder from a wire, and also prevents the wire from becoming thin and being broken. A chip coil includes electrodes provided at both ends of a core. The electrodes include an underlying metal layer (Ag), a Ni plated layer, and a Sn&mdash;Cu plated layer arranged in this sequence from the bottom thereof. Ends of a wire are embedded in the Sn&mdash;Cu plated layer of the electrodes by thermal compression bonding. When the chip coil is mounted on a land of a substrate by a reflow soldering, the Cu of the Sn&mdash;Cu plated layer is eluted into the reflow solder, and Cu elution from the wire is prevented

Electronic component having wire

A surface-mounting-type coil component includes a wound coil, a box-shaped core member, and a core member defining a cover. At two ends of the coil, two extending portions are extended in opposite directions so as to be separated by 180 degrees along a straight line passing through the center of the wound coil. The box-shaped core member includes a recess for accommodating the coil therein. The four corners of the box-shaped core member have been removed. Grooves are formed in a side wall defining the recess at 90 degree intervals. Portions of the two extending portions are accommodated in the grooves, with one end of each extending portion being disposed at a mounting surface of the box-shaped core member so as to be extended outwardly.

Coil and surface-mounting-type coil component

A wire-wound inductor includes a substantially square-flanged core member and a case core member. The substantially square-flanged core member includes an upper substantially square flange and a lower substantially square flange. The substantially square-flanged core member, around which a coil is wound, is inserted into the case core member, and the upper flange of the substantially square-flanged core member is fitted in an opening of the case core member. A planar corner abutment surface is provided at each of the four corners of the inner surface of the substantially square opening, and the corners of the upper flange abut the respective planar corner abutment surfaces.

Wire wound inductor

A wire-wound chip inductor includes a wire holding member having a core portion with a wire wound therearound and flange portions extending from both ends of the core portion in the axial direction, and a magnetic plate attached to the wire holding member to connect the flange portions. The width of the core portion and the width of the flange portions are substantially equal to each other, and the width of the magnetic plate is larger than the widths of the core portion and the flange portions. Preferably, the width of the magnetic plate is larger than the width of the outer form of the wire, and the magnetic plate has a pair of side wall portions extending from both widthwise ends thereof so as to sandwich the flange portions.

Wire-wound chip inductor

An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

A wind type coil has a core with a flange whose bottom surface has a recess, and an electrode is formed on the bottom surface of the flange and is extended to the recess. A wire is wound around a body of the core, and an end of the wire is welded to the electrode in the recess by thermocompression bonding or resistance welding. The wind type coil is armored by a resin armor, part of the electrode on the bottom surface of the flange being kept bare.

Wind type coil

An inductor which has a ferrite core and a coil wound around the ferrite core. The ferrite core is coated with borosilicate zinc glass. The ferrite core is produced by: adding a low-temperature-sintered oxidized metal, such as BiO.sub.2 and PbO, and a resin binder to ferrite powder of Mn, Fe, Co, Ni or the like; mixing the materials together; compression molding the mixture; and sintering the molded article in a low temperature.

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Fukui, Japan

Tetsuya Morinaga