Mitsubishi Heavy Industries Limited

Sumitomo Bakelite Company Limited

Tetsuya Miyamoto

Shinichi Sato

Takashi Matsunaga

Yuta Shimizu

Katsuhiko Nakajo

Taichi Omura

Satoru Katsurayama

Tomoe Yamashiro

Takenori Kawana

Takashi Mizumoto

Takashi Ikeda

Hiroyuki Yamashita

Satoru Ishikawa

Mitsuo Sugino

Masakazu Kawata

Mitsuo Onoue

Tadashi Sugimura

Yoshito Ando

To enlarge a collapsible flap and store the collapsible flap appropriately. In an amphibious vehicle () in which a flap () which receives lift from water in water navigation is provided to be deployable and storable at a front side in a travel direction of a vehicle body (), the flap () includes a lower flap () which is stored to come close to a front surface () of the vehicle body () and an upper flap () which is stored to come close to an upper surface () of the vehicle body (), and at least one of the lower flap () and the upper flap () includes a first flap member () and a second flap member () and is configured such that a flap length (L) in a direction orthogonal to a vehicle width direction is variable.

Amphibious vehicle

This cooling device for an amphibious vehicle includes: a heat exchanger mounted in the amphibious vehicle; a coolant introduction passage through which cooling air or cooling water can be introduced from the outside to the heat exchanger as a coolant; a cooling air discharge passage through which the cooling air having passed through the heat exchanger can be discharged to a cooling air discharge portion communicating with the outside; and a cooling water discharge passage through which the cooling water having passed through the heat exchanger can be discharged to a cooling water discharge portion communicating with the outside. The cooling air discharge passage and the cooling water discharge passage are formed such that at least the cooling air discharge portion and the cooling water discharge portion are independent of each other.

Cooling device for amphibious vehicle and amphibious vehicle

An amphibious vehicle includes a vehicle body, a prime mover, a drive wheel, a water propulsion device, a drive wheel transmission, and a propulsion transmission. The drive wheel is disposed on a front side of the prime mover. The water propulsion device is disposed on a rear side of the prime mover. The drive wheel transmission is disposed on the front side of the prime mover and transmits power from the prime mover to the drive wheel. The propulsion transmission is disposed on the rear side of the prime mover and transmits the power from the prime mover to the water propulsion device.

This amphibious vehicle is provided with a body (), a traveling device () that causes the body () to travel on land, a sailing device () that causes the body () to sail on water, a front flap () of which the distal end is inclined upward and the proximal end is rotatably supported by a horizontal shaft () on the front end of the body (), a hydraulic damper () serving as a damping member that damps displacement of the front flap () relative to the body (), and a compression coil spring () serving as a restoring member that restores the position of the front flap () relative to the body ().

An adhesive tapeelectrically connecting conductive components includes a resin layercontaining a thermosetting resin, a solder powderand a curing agent. The solder powderand the curing agent reside in the resin layer, the curing temperature Tof the resin layerand the melting point Tof the solder powdersatisfy T&#x2267;T+20&#xb0; C., wherein the resin layershows a melt viscosity of 50 Pa&#xb7;s or above and 5000 Pa&#xb7;s or below, at the melting point Tof the solder powder

Adhesive tape, connected structure and semiconductor package

A semiconductor device () comprises a first resin substrate () on which a first semiconductor chip () is mounted a surface thereof; a second resin substrate () on which a second semiconductor chip () is mounted on a surface thereof; and a resin base material (), joined to a front surface of the first resin substrate () and to a back surface of the second resin substrate (), so that these surfaces are electrically connected. The resin base material () is disposed in a circumference of the first resin substrate () in the surface of the first resin substrate (). Further, the first semiconductor chip () is disposed in a space section provided among the first resin substrate (), the second resin substrate () and the resin base material () in the surface of the first resin substrate ().

Semiconductor device and method for manufacturing semiconductor device

An anisotropic conductive adhesive contains conductive particles dispersed in a resin composition, wherein the resin composition includes a radical polymerization resin (A), an organic peroxide (B), a thermoplastic elastomer (C) and a phosphoric ester (D). The resin composition can further contain an epoxy silane coupling agent (E) represented by formula (2) or (3). The resin composition is mixed with other components after the radical polymerization resin (A), the thermoplastic elastomer (C), the phosphoric ester (D) and the epoxy silane coupling agent (E) are reacted. It is also possible to preliminarily react only the phosphoric ester (D) and the epoxy silane coupling agent (E) and to react the product of the preliminary reaction with the radical polymerization resin (A) and the thermoplastic elastomer (C), and then to add other components. The anisotropic conductive adhesive of the present invention can be used for electrical joining of electronic or electric parts of electrical apparatus.

Growing community of inventors

Tokyo, Japan

Tetsuya Miyamoto