The Furukawa Electric Co., Ltd.

Tetsuya Mieda

Takumi Asanuma

Yasushi Ishizaka

Kunihiko Ishiguro

Naoaki Mihara

Toshimitsu Nakamura

Keiji Saito

Masami Aoyama

Takahiro Kanaya

Toshihiro Suzuki

Satoshi Hattori

Hideto Fukuda

Shingo Mitsugi

Takanori Yamakawa

Kazuyoshi Akizuki

Provided is a power cable and a method for manufacturing a power cable that reduces occurrence of uneven thickness of an insulating layer and voids and peeling due to shrinkage and has good dielectric breakdown strength. The power cable includes the insulating layer containing 15 mass % or more of a propylene-based resin having a melting point of 110° C. or higher with respect to a whole. The power cable further includes a relationship between a cooling rate X [° C./min] at the time of manufacturing an interface portion in the insulating layer with the inner semiconductive layer and a cooling rate Y [° C./min] at the time of manufacturing a central portion of the insulating layer and is expressed by the relationship (Z), wherein X≥Y×0.8 . . . (Z).

Power cable, and method for manufacturing power cable

An insulating resin composition includes at least a base resin, and an antioxidant. The base resin includes a polyolefin resin modified with a polar group-containing molecule and an unmodified polyolefin resin. The polar group-containing molecule is at least one selected from an unsaturated dicarboxylic acid, an unsaturated dicarboxylic acid anhydride, and an unsaturated dicarboxylic acid anhydride derivative. The base resin has a sea-island structure including a first phase having the unmodified polyolefin resin and a second phase provided in the first phase and having the modified polyolefin resin. The second phase has an average diameter of 2 μm or less.

Insulating resin composition and production method therefor, insulating tape and production method therefor, insulating layer formation method, and power cable and production method therefor

An insulating tape, for coating a connection portion of a power cable, includes a resin material which includes polyethylene at least partially modified by a molecule imparting hydrophilicity, an antioxidant, and a crosslinking agent. The antioxidant has a molecular weight in a range of 190 or more and less than 1050. The antioxidant has a content in a range of 0.05 parts by mass or more and 0.8 parts by mass or less, with respect to 100 parts by mass of the polyethylene. The insulating tape has a thickness in a range of 50 &#x3bc;m or more and 250 &#x3bc;m or less.

Insulating tape for coating connection portion of power cable, method for forming insulating coating on exterior surface of connection portion of power cable, and power cable

A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.

Resin composition for sealing organic electronic device element, resin sheet for sealing organic electronic device element, organic electroluminescent element, and image display apparatus

An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.

Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same

A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. 

Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device

A curable and hygroscopic resin composition for sealing electronic devices, comprising: a radically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a photo-radical polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. 

A curable and hygroscopic resin composition for sealing electronic devices, having at least a (meth)acrylate oligomer (a) having the number-average molecular weight of 1,500 to 5,000, a low molecular weight (meth)acrylate (b) having an average molecular weight of 170 to 500, a moisture-reactive organometallic compound (c), and a polymerization initiator (d), wherein the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b) are multifunctional (meth)acrylates in which the number of (meth)acryloyl groups is from 1.5 to 3 in one molecule of each of the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b); a sealing resin; and an electronic device.

Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic device

A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein Rand Reach represent a hydroxyl group or HC&#x2550;C(R)&#x2014;COO&#x2014;; Rand Reach represent a C1-C16 substituted or unsubstituted divalent organic group; R, Rand Reach represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; Rand Rare never both a hydroxyl group. 

Resin composition for sealing electronic device, and electronic device

A transparent resin composition for organic EL element sealing and other things having a sufficient moisture blocking effect and excellent flexibility is provided. A thermoplastic resin, a tackifying resin, and an organometallic compound having at least an ester bond and represented by the following formula are included, and in which the light transmittance for light is 85% or higher, the relationship: AM/Y&#x3c;162 is satisfied, and the thermoplastic resin includes a hydride of a styrene-based A-B-A type triblock body. (wherein R, R, Rand Rrepresent organic groups including an alkyl group, an aryl group, a cycloalkyl group, and an acyl group each having a carbon number of 1&#x2dc;8; Rand Rrepresent organic groups including an alkyl group, an aryl group, an alkoxy group, a cycloalkyl group, and an acyl group each having a carbon number of 1&#x2dc;8; and M represents a trivalent metal atom.)

Transparent resin composition for organic electroluminescent element sealing, resin sheet for organic electroluminescent element sealing, and image display device

A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25&#xb0; C., and containing a organometallic compound and a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 20,000, and an iodine value less than 40 g/100 g, and having no polar group, wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon being heated at 85&#xb0; C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.

Filler material for organic electroluminescent element and method of sealing organic electroluminiscent element

An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand:M(OR)&#x2003;&#x2003;Formula (1) 

Resin composition for sealing electronic devices, and electronic device

Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device

A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.

Resin composition for sealing organic electroluminescent element, sealing film for organic electroluminescent element, gas-barrier film for organic electroluminescent element, and organic electroluminescent element using these films

A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25&#xb0; C., and containing a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 32,000 and an organometallic compound represented by M-L(wherein, M represents a metal atom; L represents an organic group having 9 or more carbon atoms and 1 or more oxygen atoms, and all of L represent the same organic group; and n represents the valence of a metal atom M), wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon heating at 85&#xb0; C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.

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Tokyo, Japan

Tetsuya Mieda