Toray Industries, Inc.

Toray Advanced Film Co., Ltd.

Tetsuya Machida

Masatoshi Ohkura

Takuji Higashioji

Yasuyuki Imanishi

Norihide Inoue

Kenji Tsunashima

Tetsuya Tsunekawa

Jun Sakamoto

Atsushi Ishio

Ryosuke Matsui

Shigetoshi Maekawa

Yusuke Baba

Megumi Yamada

Kenta Takahashi

Naoko Tamura

Natsuki Nakamichi

Toshiumi Tatsuki

Naoya Nishimura

Atsushi Toray Shijocho-Shataku A-3-3 Ishio

A laminated film exhibits a certain adhesive property to various adherends having shapes or different irregularity shapes. The laminated film includes a resin layer A on one surface of a substrate and a resin layer B on the other surface. The resin layer A has a ten-point average surface roughness Rz(a) of 1.5 &#x3bc;m or more and 5.0 &#x3bc;m or less and a storage elastic modulus G' at 25&#xb0; C. and 1 Hz of 3.0&#xd7;10Pa or more.

Laminated film

A protective film is capable of protecting and preserving an optical sheet surface, particularly the back surface of a prism sheet, independent of the shape and composition thereof in a range of adhesive forces appropriate for various adherends. A layered film having an adhesive layer having a styrene-based elastomer as the main component thereof on at least one surface of a base material layer, the layered film characterized in that the loss tangent tan &#x3b4; and the shear storage modulus G' of the elastomer at 1 Hz in a temperature range of 30-60&#xb0; C. are within specific ranges.

This film provides a polyethylene terephthalate film whereby dimensional variation in various steps can be reduced, particularly when the film is used as a substrate film for a flexible device, and that is suitable as a substrate film having minimal curl and excellent appropriateness for processing. This biaxially oriented polyethylene terephthalate film has a degree of crystallinity (Xc) of 0.35 to 0.50, the intrinsic viscosity (IV) of the resin constituting the film is 0.66-1.0 dl/g, the coefficient of thermal expansion at a temperature of 50-170&#xb0; C. in each of the machine direction and transverse direction of the film is 0.29 ppm/&#xb0; C., and the degree of thermal shrinkage at 180&#xb0; C. in each of the machine direction and transverse direction of the film is 0.5%-1.0%.

Biaxially oriented polyethylene terephthalate film and method for producing same

It is aimed to provide a polyarylene sulfide film for an acoustic instrument vibrating plate excellent in heat resistance, molding processability, acoustic properties, and also heat moldability. Provided is a polyarylene sulfide film wherein the elongation at break in either a longitudinal direction or a width direction of the film is 100% or more and 250% or less, and the Young's modulus in either a longitudinal direction or a width direction of the film is 1.5 GPa or more and less than 4 GPa.

Polyarylene sulfide film

A biaxially oriented polyarylene sulfide film which has an excellent elongation at break and flatness is provided. The biaxially oriented film may be a biaxially oriented polyarylene sulfide film which is substantially composed of a polyarylene sulfide resin (A), wherein one of the elongations at break in the machine direction and in the transverse direction of the film is not lower than 110%; one of the breaking stresses in the machine direction and in the transverse direction of the film of the film is not higher than 200 MPa; and both of the heat shrinkage ratio in the machine direction of the film and that in the transverse direction of the film at 260&#xb0; C. for 10 minutes are not less than 0% and not more than 10%.

Biaxially oriented polyarylene sulfide film and method for producing the same

A biaxially oriented polyphenylene sulfide film contains polyphenylene sulfide and polyether imide, wherein the contents of the polyphenylene sulfide and the polyether imide are 70 to 99 parts by weight and 1 to 30 parts by weight respectively when the total amount of the polyphenylene sulfide and the polyether imide is taken as 100 parts by weight, and further contains a compound having one or more groups selected from an epoxy group, an amino group and an isocyanate group as a compatibilizing agent in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the polyphenylene sulfide and polyether imide in total, and the polyether imide forms a dispersed phase with an average particle diameter of 10 to 500 nm and the biaxially oriented polyphenylene sulfide film exhibits a tensile elongation at break of 110 to 250% in both the longitudinal direction and width direction.

Biaxially oriented polyphenylene sulfide film

A biaxially oriented polyarylene sulfide film made of a polyarylene sulfide resin composition has a melt crystallization temperature of not lower than 160&#xb0; C. and not higher than 220&#xb0; C. The biaxially oriented polyarylene sulfide film contains 70 to 99 parts by weight of the polyarylene sulfide and 1 to 30 parts by weight of thermoplastic resin A; the thermoplastic resin A constitutes a dispersed phase having an average dispersion diameter of 50 nm to 500 nm. The biaxially oriented polyarylene sulfide film has a breaking stress at 200&#xb0; C. in the machine direction and/or transverse direction of not less than 30 MPa and not more than 90 MPa and has an elongation at break at 200&#xb0; C. in the machine direction and/or transverse direction of not less than 100% and not more than 250%.

Biaxially oriented polyarylene sulfide film

In order to provide a film having excellent heat resistance, thermal dimensional stability, and mechanical properties, in particular, a film capable of satisfying required properties, e.g., higher strength in accordance with the reduction in thickness of a base film, improved thermal dimensional stability and mechanical properties in a use environment, and higher heat resistance and improved thermal dimensional stability in accordance with the needs for miniaturization and more functionality in electrical and electronic areas, a thermoplastic resin is allowed to contain transition metal oxide particles, and is formed into a biaxially oriented thermoplastic resin film, wherein the melting point of the film is allowed to become higher than the melting point of the thermoplastic resin to be used. Preferably, the difference between a peak temperature (melting point T) of the heat of fusion in the first run of the measurement of the biaxially oriented thermoplastic resin film with a differential scanning calorimeter (DSC) and a peak temperature (melting point T) of the heat of fusion in the second run is allowed to satisfy the following Formula.2&#xb0; C.&#x2266;T-T&#x2266;30&#xb0; C. Alternatively, the plane orientation factor of the biaxially oriented thermoplastic resin film containing the transition metal oxide particles is controlled at 0.120 or more and less than 0.280.

Biaxially oriented thermoplastic resin film

Disclosed are a liquid-crystalline resin laminated film comprising a liquid-crystalline resin layer and a non-liquid-crystalline thermoplastic resin layer laminated on at least one surface of the liquid-crystalline resin layer, and having an interlayer adhesiveness of at least 30 N/cm; and a liquid-crystalline resin laminated film comprising a liquid-crystalline resin layer and a non-liquid-crystalline thermoplastic resin layer laminated on at least one surface of the liquid-crystalline resin layer, and satisfying T &gE;T wherein T and T indicate the thermal deformation temperature of the non-liquid-crystalline thermoplastic resin layer and that of the liquid-crystalline resin layer, respectively, measured through thermal mechanical analysis (TMA). These are obtained by forming a non-liquid-crystalline thermoplastic resin layer on at least one surface of a liquid-crystalline resin layer through co-extrusion, followed by stretching the resulting laminated film.

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Otsu, Japan

Tetsuya Machida