Hitachi, Ltd.

Tetsuya Kawashima

Daisuke Matsumoto

Hiroshi Kamizuma

Yukio Hattori

Akira Mima

Yuuichi Mabuchi

Ryouhei Miyagawa

Tomonori Ichikawa

Yuichi Mabuchi

Masahiro Seo

Hangxian Gao

Hiroshi Kamiduma

There is provided a power conversion apparatus including a first power semiconductor module, a second power semiconductor module, a control circuit for driving the first power semiconductor module and the second power semiconductor module, and liquid-cooling type cooling jackets, wherein the second power semiconductor module is disposed closer to an upper surface in the gravity direction than the first power semiconductor module is, the cooling jackets include a refrigerant containing hydrogen molecules and a refrigerant flow path at least between the first power semiconductor module and the second power semiconductor module, and the control circuit performs control such that the operating time period of the second power semiconductor module is shorter than the operating time period of the first power semiconductor module.

Power conversion apparatus

To improve accessibility with respect to a power conversion unit in a power converter. The power converter includes a circuit connection part including a positive electrode conductor, a negative electrode conductor and an AC conductor, a power semiconductor module positioned in a particular direction with respect to the circuit connection part and connected to the positive electrode conductor, the negative electrode conductor and the AC conductor and a capacitor positioned in the particular direction with respect to the circuit connection part and connected to the positive electrode conductor and the negative electrode conductor. The positive electrode conductor is connected to a positive electrode conductor of another power conversion unit through a unit connection part positioned in an opposite direction of the particular direction with respect to the circuit connection part. The negative electrode conductor is connected to a negative electrode conductor of another power conversion unit through the unit connection part.

Power conversion unit, power converter and method of manufacturing power converter

An imbalance of control signals between two power semiconductor elements is reduced. A first power semiconductor module and a second power semiconductor module are arranged in a predetermined direction along a surface of a control signal wiring circuit board, each of longitudinal directions of the first power semiconductor module and the second power semiconductor module along the surface of the control signal wiring circuit board is a predetermined direction, and, in a first control signal wiring, a distance between an external control signal terminal and a second control signal terminal is equal to a distance between the external control signal terminal and a first control signal terminal.

Power conversion unit, power converter, and power conversion method

An uninterruptible power-supply system is a power converter having a PN laminated bus bar and a plurality of power conversion units and supplying power from a commercial power supply via a converter and an inverter. The power conversion units each have positive side terminals connected to each other and negative side terminals connected to each other through the PN laminated bus bar. At least one power conversion unit constitutes a phase of the converter. At least another one power conversion unit constitutes a phase of the inverter and has the positive side terminal lying adjacent to and connected through the PN laminated bus bar to the positive side terminal of the corresponding power conversion unit constituting the phase of the converter and the negative side terminal lying adjacent to and connected to the negative side terminal of the corresponding power conversion unit constituting the phase of the converter.

Power conversion device and power conversion method for power conversion device

The present invention reduces the footprint of a power conversion device. A first power semiconductor module and a second power semiconductor module are connected to a positive conductor, a negative conductor, and an alternating-current conductor. An external alternating-current terminal, the first power semiconductor module, the second power semiconductor module, a capacitor, and an external direct-current terminal including an external positive terminal and an external negative terminal are arrayed on a straight line extending in the longitudinal direction of a circuit connection section. The external alternating-current terminal is disposed at one longitudinal end of the circuit connection section. The external direct-current terminal is disposed at the other longitudinal end of the circuit connection section.

Power conversion unit and power conversion device

A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.

Cooling structure of heating element and power conversion device

A power conversion device capable of reducing a temperature variation between a plurality of semiconductor modules is provided. The power conversion device comprises condensers, a plurality of semiconductor modules, heat dissipation unitsto, a bus barconnecting the condenserswith the plurality of the semiconductor modules, and a ventilation unit having cool wind blow. The power conversion module has features that the plurality of semiconductor modulesare arranged apart from the condensersand in a line in a longitudinal direction of the bus barand that the cool windblows in a direction from the condenserstoward the plurality of semiconductor modulesthat are mounted.

Power conversion device

A cooling structure is provided. The cooling structure includes cooling surfaces on two confronting side surfaces; a plurality of double-sided-cooling power module, the heat receiving block pinching the heating elements arranged in a vertical direction on the confronting side surfaces, first and second cooling devices, each including the heat radiating fins, disposed above the heating elements, extending in a horizontal direction, and a pressure contacting part configured to contact the heating elements and the receiving block with a pressure force. The heat radiation fins are blown from a side of the electric terminal.

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Tokyo, Japan

Tetsuya Kawashima