Opnext Japan, Inc.

Tetsuya Kato

Osamu Kagaya

Masanobu Okayasu

Hiroyuki Arima

Naoki Matsushima

Kazumi Kawamoto

Hideyuki Kuwano

Michihide Sasada

Kazuhiko Naoe

Yoshiaki Niwa

A high frequency substrate, on which a high frequency substrate transmission line for connecting a chip carrier transmission line and a package substrate transmission line is formed, is mounted while being inclined with respect to a package, so that each distance between the transmission lines can be reduced. Thereby, the lengths of wires for connecting the transmission lines can be reduced so as to improve frequency characteristics of an optical modulator module.

Optical modulator module

A transmission line with a bending portion is provided, which line comprises any one of a coplanar line, another coplanar waveguide line formed on the dielectric substrate under which a ground layer is provided and a coplanar strip line. A chamfered portion is provided on the outer angular portion of the bending portion of the signal wiring conductor and a triangular conductor is disposed to an inner angular portion thereof. Given that length of the chamfered portion is defined as a, and length of the wiring edge side of the triangular conductor is defined as b and width of the signal wiring conductor is defined as c, it is arranged such that a is greater than b+c&#xd7;square root of 2. Thereby, a transmission line or an optical module of smaller reflection loss at the bending portion thereof and of improved high-frequency characteristics is provided.

High-frequency transmission line and an optical module incorporating the same line

The present invention provides an optical modulator module comprising: a chip carrier; a semiconductor optical modulator for modulating light based on an electronic signal; a strip conductor electrically connected to the semiconductor optical modulator; a first resistor electrically connected to the semiconductor optical modulator; and a second resistor electrically connected in series to the first resistor; wherein the semiconductor optical modulator, the strip conductor, and the first and second resistors are disposed on the chip carrier; and wherein the frequency characteristics of the optical modulator module is adjusted by selecting to short or not to short both ends of the first resistor by use of a wire as necessary.

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Hiratsuka, Japan

Tetsuya Kato