Nuvoton Technology Corporation Japan

Panasonic Intellectual Property Management Co., Ltd.

Tetsuya Kamada

Shigeo Hayashi

Tooru Aoyagi

Takashi Kuwaharada

Kiyomi Hagihara

Masahiro Hayashi

Hideaki Usukubo

Hidesato Hisanaga

Hiroki Shirozono

Ryota Yuge

Toshikazu Shimokatano

A white light emitting device includes: first light-emitting units to which a first current is applied; and second light-emitting units to which a second current which is different from the first current is applied. When the first current is applied to the first light-emitting units and the second current is applied to the second light-emitting units, an average emission chromaticity of the first light-emitting units and an average emission chromaticity of the second light-emitting units are identical colors. When the same current is applied to both the first light-emitting units and the second light-emitting units, the average emission chromaticity of the first light-emitting units and the average emission chromaticity of the second light-emitting units are non-identical colors.

White light emitting device

A light source device includes: a substrate; a light-emitting unit matrix including a plurality of light-emitting units disposed in a matrix on the substrate; and a reflective resin disposed in a region, on the substrate, including a region where the light-emitting unit matrix is disposed. The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit adjacent to each other in a column direction of the light-emitting unit matrix. The reflective resin includes a first reflective portion disposed between the first light-emitting unit and the second light-emitting unit and extending in a direction intersecting the column direction. At least a portion of an upper surface of the first reflective portion protrudes beyond an upper surface of the first light-emitting unit and an upper surface of the second light-emitting unit.

Light source device and light projecting device

A light emitting device includes a light emitting element; a sub-mount including a sub-mount substrate with a front surface on which the light emitting element is disposed, and a back surface electrode disposed in a back surface that is on a back side of the front surface of the sub-mount substrate; a main-mount in which the sub-mount is disposed, the main-mount including a front surface metal pattern including a wiring electrode bonded to the back surface electrode via solder. The front surface metal pattern has a slit, in a plan view, at a position away from a disposition region in which the sub-mount is disposed.

Light emitting device and solder bond structure

Growing community of inventors

Hyogo, Japan

Tetsuya Kamada