Kabushiki Kaisha Nihon Micronics

Tetsuya Iwabuchi

Hidehiro Kiyofuji

Yuji Miyagi

Toshiyuki Kudo

Seiji Kanazawa

An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.

Method and apparatus for testing integrated circuit

A probe for electrical test provided with positioning marks parallel to a plane where tips are provided and at a height position lower than the plane on a plane directed in the same direction as the plane, the positioning marks are in a predetermined positional relation to said tips. The positioning marks contain information indicating an existing direction of the tips when the positioning marks are observed from the projecting direction of the tips.

Growing community of inventors

Aomori, Japan

Tetsuya Iwabuchi