Nichia Corporation

Tetsuya Ishikawa

Takuya Nakabayashi

Tomokazu Maruyama

Tadaaki Ikeda

Shoji Hosokawa

Takashi Kaide

Kenichi Aoyagi

Gensui Tamura

Toshifumi Imura

Yuki Kageyama

A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.

Light emitting device and method of producing light emitting device

A light emitting device includes light emitting elements, light-transmissive members, a covering member, at least one first protrusion, and two second protrusions. The light emitting elements are aligned in a first direction. The light-transmissive members are respectively disposed on upper surfaces of the light emitting elements. The covering member includes at least one first covering portion and two second covering portions. The at least one first covering portion is arranged between adjacent ones of the light-transmissive members, and the second covering portions are arranged at distal ends of the light emitting device in the first direction with the light-transmissive members being arranged between the second covering portions. The at least one first protrusion is arranged on an upper surface of the at least one first covering portion and being spaced apart from the light-transmissive members. The second protrusions respectively arranged on upper surfaces of the second covering portions.

Light emitting device

A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.

Light-emitting device

A light emitting device includes a light emitting element including a first surface; a light guide member covering at least a part of a lateral surface of the light emitting element; a first wavelength conversion member covering the first surface and including a first wavelength conversion particles; and a reflective member being in contact with the light emitting element. The first wavelength conversion member has a thickness of 60 &#x3bc;m or more and 120 &#x3bc;m or less. The first wavelength conversion particles have an average particle size of 4 &#x3bc;m or longer and 12 &#x3bc;m or smaller; the first wavelength conversion particles have a central particle size of 4 &#x3bc;m or longer and 12 &#x3bc;m or smaller. A weight ratio of the first wavelength conversion particles is 60% by weight or more and 75% by weight or less with respect to the total weight of the first wavelength conversion member.

Light-emitting unit

A wavelength converting member comprising a first wavelength converting layer containing: a first fluorescent material having a light emission peak wavelength in a range of 620 nm or more and 660 nm or less; a second fluorescent material having a light emission peak wavelength in a range of 510 nm or more and 560 nm or less; and a resin, wherein the average particle diameter, as measured according to a Fisher Sub-Sieve Sizer method, of the first fluorescent material is in a range of 2 &#x3bc;m or more and 30 &#x3bc;m or less, wherein the second fluorescent material comprises a &#x3b2;-SiAlON fluorescent material, the circularity of the &#x3b2;-SiAlON fluorescent material is 0.7 or more, and the volume average particle diameter, as measured according to a laser diffraction scattering particle size distribution measuring method, of the &#x3b2;-SiAlON fluorescent material is in a range of 2 &#x3bc;m or more and 30 &#x3bc;m or less, and wherein the thickness of the first wavelength converting layer is in a range of 50 &#x3bc;m or more and 200 &#x3bc;m or less.

Wavelength converting member and light emitting device

A light-emitting device includes a substrate, a plurality of light-emitting elements aligned along a longitudinal direction, and a covering member. The substrate includes a pair of first depressed portions and a second depressed portion each opening on a back surface and a bottom surface of a base and positioned on both end sides of the base in the longitudinal direction. The second depressed portion has a width larger than a width of the first depressed portions as measured along a height direction. First metal films extend from inside the first depressed portions to the back surface. A second metal film extends from inside the second depressed portion to the back surface. A solder mask covers at least a part of each of the first metal films and at least a part of the second metal film on the back surface of the base.

A light emitting device of a side-surface light emission type includes a package defining a recess and having a shape elongated in a lateral direction, the package including a pair of lead electrodes arranged next to each other in the lateral direction and forming main portions of a bottom of the recess, and a molded body integrally formed with the pair of lead electrodes and defining sidewalls of the recess, and a light emitting element disposed on at least one of the pair of lead electrodes at the bottom of the recess. The molded body has a reinforcing portion connecting between two sidewalls of the recess opposite to each other in a longitudinal direction. The reinforcing portion is made of two end portions respectively connected to the two sidewalls, and an intermediate portion provided between the two end portions.

A light emitting device includes a resin molding, first and second leads, and a light emitting element. The resin molding includes a front surface defining an opening, and a lower surface adjacent to the front surface. The first and second leads each includes an outer lead portion and an inner lead portion. The outer lead portion protrudes from the lower surface of the resin molding, and includes a bent portion bent along the lower surface. A surface on an inner side of the bent portion including a first recessed section. The inner lead portion includes an embedded portion embedded in the resin molding, and an exposed portion exposed in the opening. A surface of the embedded portion opposite from the surface where the first recessed section is provided includes a second recessed with a part of the resin molding being positioned in the second recessed section.

Growing community of inventors

Anan, Japan

Tetsuya Ishikawa