Fuji Electric Co., Ltd.

Tetsuya Inaba

Yoshinari Ikeda

Yoshikazu Takahashi

Takafumi Yamada

Katsuhiko Yanagawa

Daisuke Kimijima

Motohito Hori

Katsumi Taniguchi

A semiconductor module includes a plurality of semiconductor chips that include gate electrodes on front surfaces, a gate terminal that receives a control signal from outside, and a print substrate. The print substrate includes a gate wiring layer that separates the control signal that is input into the gate terminal and passes the control signal to the gate electrodes of the semiconductor chips, and a cross-sectional area of the gate wiring layer becomes larger as the gate wiring layer gets closer to the gate terminal from the gate electrodes.

Semiconductor module

A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.

Unit for semiconductor device

A power semiconductor module is equipped with: a metal base; semiconductor chips electrically connected with and fixed to the metal base; and an insulating substrate fixed to the metal base and having a circuit plate on one surface. Additionally, the power semiconductor module is further equipped with a circuit board that is provided so as to face the semiconductor chips and the insulating substrate and that electrically connects electrodes of the semiconductor chips and the circuit plate of the insulating substrate. Further, the power semiconductor module is equipped with a conductive post that is electrically connected to at least one of either the electrodes of the semiconductor chips or the circuit plate of the insulating substrate while being electrically connected to the metal film of the circuit board.

Power semiconductor module

A semiconductor device includes: a semiconductor element having a gate and source electrodes; an insulating substrate which is provided with an insulating plate, a first circuit plate and a second circuit plate, the first circuit plate provided in a main surface of the insulating plate to be electrically connected to the gate electrode, the second circuit plate provided in the main surface to surround the first circuit plate and to be electrically connected to the source electrode; a first terminal, being column-shaped and electrically and mechanically connected to the first circuit plate; and a second terminal which is provided with a cylindrical body portion and support portions, the body portion has a through hole into which the first terminal is inserted with a gap, the support portions disposed in end portions of the body portion and electrically and mechanically connected to the second circuit plate.

Semiconductor device

In a semiconductor module, second semiconductor chips (e.g., diodes) are disposed closer to a laminated substrate than first semiconductor chips (MOSFETs). When a control signal supplied to gate electrodes of the first semiconductor chips (MOSFETs) is off, an electric current produced by a voltage from source terminals to a drain board mainly flows through the second semiconductor chips.

A semiconductor module includes a semiconductor element having a gate electrode and source electrode on the front surface, and a drain electrode on the rear surface, the drain electrode being electrically connected to the front surface of a drain plate; a laminated substrate having, on the front surface of an insulating plate, a first circuit plate to which the gate electrode is electrically connected, and a second circuit plate to which the source electrode is electrically connected, and which is disposed on the front surface of the drain plate; a gate terminal disposed on the first circuit plate; a source terminal disposed on the second circuit plate; and a cover disposed opposite to the front surface of the drain plate, and having an opening in which the gate terminal and the source terminal are positioned and a guide groove contacting the opening and extending to the outer peripheral portion.

Semiconductor module and semiconductor device

A semiconductor device includes a semiconductor chip having a front electrode and a rear electrode; a conductive plate having a main surface connected to the rear electrode of the semiconductor chip; an insulating plate fixed to a surface of the conductive plate opposite to the main surface; and a ceramic case having first and second terminals buried therein, a cavity accommodating the semiconductor chip, the conductive plate, and the insulating plate, and an electrode surface opposite to an opening portion of the cavity. The first terminal has one end connected to the front electrode of the semiconductor chip, and another end exposed from the electrode surface. The second terminal has one end connected to the main surface of the conductive plate, and another end exposed from the electrode surface. The ceramic case and the insulating plate form a housing.

A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit () includes copper blocks (), an insulating substrate () with a conductive pattern, an IGBT chip (), a diode chip (), a collector terminal pin (), implant pins () fixed to the chips () by solder (), a printed circuit board () having the implant pins () fixed thereto, an emitter terminal pin (), a control terminal pin (), a collector terminal pin (), and a resin case () having the above-mentioned components sealed therein. The copper blocks () make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units () can be combined with an inter-unit wiring board to form any circuit.

Growing community of inventors

Matsumoto, Japan

Tetsuya Inaba