Murata Manufacturing Co., Ltd.

Tetsuya Ikeda

Takayuki Tsukizawa

Hiroji Tani

Osamu Chikagawa

Akiyoshi Kawamura

Ryuichiro Wada

Takashi Noma

Shinichiro Banba

Yuki Ito

Tomoya Yokoyama

Yoshihiko Nishizawa

Kazuhito Oshita

A composite electronic component with a built-in coil is provided which can be produced inexpensively, which can effectively increase insulating reliability, and which has the antistatic function. Coil wirings are disposed inside a sintered body that is formed by stacking a plurality of ferrite layers, which are fired as an integral unit. Voltage nonlinear members are incorporated in the sintered body at a different height position from those of the coil wirings. First inner electrodes and second inner electrodes are disposed in opposing relation with the voltage nonlinear members interposed therebetween. A magnetic circuit forming portion is constituted by a part of the ferrite layers and the coil wirings in a portion in which the coil wirings are arranged, and an antistatic portion is constituted in a portion in which the remaining ferrite layers, the voltage nonlinear members, and the first and second inner electrodes are arranged.

Composite electronic component

In a method for manufacturing an ESD protection device and an ESD protection device, on sheets defining insulating layers, portions defining a first connection conductor and a second connection conductor and a portion defining a mixed portion are formed, then the sheets are laminated and heated. The mixed portion is formed using a mixed portion formation material containing a cavity formation material and a solid component containing at least one of (i) a metal and a semiconductor, (ii) a metal and ceramic, (iii) a metal, a semiconductor, and ceramic, (iv) a semiconductor and ceramic, (v) a semiconductor, (vi) a metal coated with an inorganic material, (vii) a metal coated with an inorganic material and a semiconductor, (viii) a metal coated with an inorganic material and ceramic, and (ix) a metal coated with an inorganic material, a semiconductor, and ceramic. The cavity formation material disappears during heating.

Method for manufacturing ESD protection device and ESD protection device

A highly reliable ESD protection device that prevents failure of discharge and variation of a discharge start voltage even when protection from static electricity is repeatedly performed includes a cavity provided in a ceramic multilayer substrate. First and second discharge electrodes are provided in the ceramic multilayer substrate and face each other across a gap. A tip of the first discharge electrode and a tip of the second discharge electrode are positioned at edges of the cavity or at positions receded from the edges.

ESD protection device

In a laminated inductor element, a magnetic ferrite layer sandwiched between two conductor patterns is thinner than other magnetic ferrite layers. Therefore, a crack occurs in the magnetic ferrite layer due to firing. As a result of the occurrence of this crack, a stress applied to each layer is relaxed, and it becomes possible to avoid warpage, a crack, or the like. In addition, in the laminated type inductor element, the two conductor patterns are electrically connected by two via holes, and subjected to a same potential. Since the two conductor patterns correspond to a same wiring pattern and a coil of coil conductor is defined by the two conductor patterns, even if upper and lower coil conductors are electrically in contact with each other due to the crack, the two conductor patterns are not put into a short-circuited state.

Laminated type inductor element and manufacturing method therefor

An ESD protection device includes an insulating ceramic substrate excluding a glass ceramic substrate, first and second discharge electrodes provided on the insulating ceramic substrate and including respective edges that face each other with a gap therebetween, and a discharge supporting electrode provided on the insulating ceramic substrate so as to electrically connect the first and second discharge electrodes to each other, the discharge supporting electrode including a ceramic material and metal particles whose surfaces are coated with insulating inorganic material powder. A thermosetting resin-cured layer including a cavity is provided on the insulating ceramic substrate so that the portions of the first and second discharge electrodes that face each other with a gap therebetween are present in the cavity.

ESD protection device and method for producing the same

An ESD protection device includes a ceramic multilayer substrate in which a plurality of ceramic insulating layers are laminated; a first connecting conductor extending through the main surfaces of the insulating layer; a mixture portion extending along a main surface of the insulating layer including the first connecting conductor and connected to the first connecting conductor, the mixture portion including a material dispersed therein, the material including at least one selected from a metal and a semiconductor, a metal and a ceramic, a semiconductor and a ceramic, a semiconductor, and a metal coated with an inorganic material; and a second connecting conductor that has electrical conductivity and is connected to the mixture portion and extends along the main surface of the insulating layer on which the mixture portion is provided.

An ESD protection device includes a ceramic multilayer substrate including a plurality of laminated insulating layers, an external electrode, at least one of an in-plane connecting conductor and an interlayer connecting conductor, and a mixture portion. The mixture portion is provided along a principal surface of one of the insulating layers and includes a dispersed material including at least one of metal and semiconductor; metal and ceramic; metal, semiconductor, and ceramic; semiconductor and ceramic; semiconductor; metal coated with an inorganic material; metal coated with an inorganic material and semiconductor; metal coated with an inorganic material and ceramic; and metal coated with an inorganic material, semiconductor, and ceramic. The mixture portion is connected to the external electrode and at least one of the in-plane connecting conductor and the interlayer connecting conductor.

In a method for producing a multilayer ceramic substrate, a green ceramic laminate includes green conductive patterns arranged on a plurality of ceramic green sheets and portions to be formed into a plurality of multilayer ceramic substrates. Boundary-defining conductive patterns are arranged on the ceramic green sheets and along boundaries of the multilayer ceramic substrates. The boundary-defining conductive patterns have firing shrinkage characteristics that are different from those of the ceramic green sheets. During firing of the green ceramic laminate, cavities adjacent to edges of the boundary-defining conductive patterns are formed. A sintered ceramic laminate is divided at edges passing through the cavities.

Method for producing multilayer ceramic substrate

An auxiliary-layer-lined unfired ceramic body, having a step portion in a principal surface thereof, has an unfired ceramic body and an auxiliary layer which is adhered to one principal surface of the unfired ceramic body and which is made of a material that is substantially unsinterable at a temperature at which the unfired ceramic body is fired. The auxiliary-layer-lined unfired ceramic body is fired at a temperature at which the unfired ceramic body is sinterable but the auxiliary layer is substantially unsinterable, while the auxiliary layer remains adhered to the unfired ceramic body. A pressing operation is performed using a die having a projection placed on the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer, so that the step portion, having a shape corresponding to the outer shape of the die projection, is formed in the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer.

Ceramic substrate production process and ceramic substrate produced using the process

A method for manufacturing a ceramic multi-layered substrate includes a first step of forming a green ceramic laminate including a plurality of stacked green ceramic base layers, a second step of firing the green ceramic laminate to sinter the green ceramic layers, and a third step of separating the sintered ceramic laminate formed by firing the green ceramic laminate into a ceramic multi-layered substrate. The green ceramic base layers stacked in the first step include a separation pattern formed along separation lines, the separation pattern disappearing during firing. In the third step, the sintered ceramic laminate is separated into a plurality of ceramic multi-layered substrates separated through a cavity formed by the disappearance of the separation pattern during the firing in the second step.

Method for manufacturing a ceramic multi-layered substrate

A multilayer composite including a core made of a magnetic ceramic sintered compact disposed therein, and shrinkage restraining layers including an inorganic powder that is not substantially sintered at the sintering temperature of the green ceramic layers are sintered in order to reduce the difference in shrinkage behavior during firing between the core and the green ceramic layers.

Method for manufacturing monolithic ceramic electronic component

An electronic component includes a wiring board having a wiring pattern, a surface mount device mounted on an upper surface of the wiring board, and a cap arranged to cover the wiring board. The cap includes a top portion made of a flat ceramic member, and a leg portion made of a columnar member having a height similar to a height of the surface mount devices.

Electronic component and its manufacturing method

A chip-type electronic component built-in multilayer board includes a multilayer board including two or more layered dielectric layers and an inner conductor pattern, and a chip-type electronic component which is provided at the interface of the upper and lower dielectric layers and includes an external terminal electrode. The external terminal electrode is connected to an in-plane conductor provided at a interface via a first connection conductor extending along the chip-type electronic component in the lower direction from the interface of the upper and lower dielectric layers, and a second connection conductor extending along the chip-type electronic component in the upper direction from the interface of the upper and lower dielectric layers.

Multilayer board with built-in chip-type electronic component and manufacturing method thereof

The present invention provides a conductive paste and a conductor and a ceramic substrate using the conductive paste which, when used as a conductive material for a ceramic substrate, can prevent cutting of the conductor in a through hole and peeling of the conductor from the through hole side wall during burning, thereby improving the yield and reliability of through hole conduction. The conductive paste contains Cu powder, Ni powder, glass frit and an organic vehicle, the amount of the Ni powder being about 1 to 20% by weight relative to the total amount of the Cu powder and the Ni powder, and the amount of the glass frit being about 1 to 40% by weight relative to the total amount of the Cu powder, the Ni powder and the glass frit.

Conductive paste and conductor and ceramic substrate comprising the same

Disclosed herein is copper paste for forming a conductive thick film, which contains 80 wt. % to 95 wt. % of spherical first copper powder of 1 .mu.m to 10 .mu.m in mean particle diameter, 0.5 wt. % to 15 wt. % of second copper powder of less than 1 .mu.m in mean particle diameter, and 1 wt. % to 15 wt. % of glass frit of 0.5 .mu.m to 2.0 .mu.m in mean particle diameter respectively as solid components. A conductive thick film obtained by applying the copper paste onto a substrate and baking the same exhibits excellent solderability as well as high adhesive strength to the substrate, and this adhesive strength is excellently maintained even if the thick film is exposed to a heat hysteresis.

Growing community of inventors

Nagaokakyo, Japan

Tetsuya Ikeda