Tdk Corporation

Tetsuya Hiraki

Yoshiaki Tanaka

Kazuya Watanabe

Naoki Ohta

Hisayoshi Watanabe

Suguru Watanabe

Kenzo Makino

Minoru Ota

Hideyuki Ukita

Hiraku Hirabayashi

Satoshi Miura

Takahiko Machita

Nozomu Hachisuka

Kazuhiko Maejima

Naomichi Degawa

Masachika Hashino

Hidekazu Kojima

Osamu Nakazawa

Hirotaka Gomi

Yuji Otsubo

Sohei Horiuchi

A magnetic sensor includes a first path and a second path, a plurality of structures, and a plurality of first electrodes and a plurality of second electrodes. The first path includes at least one first array. The second path includes at least one second array. The at least one first array and the at least one second array are disposed so that they are arranged in a first direction. The at least one first array and the at least one second array each include an odd number of structures disposed so that they are arranged in a second direction.

Magnetic sensor and magnetic sensor system

A magnetic field detection device includes a base, a first yoke, and a magneto-resistive effect element. The first yoke is provided on the base, and includes first and second principal surfaces each extending along a first plane, and a first end surface coupling the first and second principal surfaces. The magneto-resistive effect element is provided on the base, and includes a magnetization free layer disposed at a position overlapped with the first yoke in a first direction along the first plane. The first end surface includes an inverted tapered surface inclined relative to the first plane and extending closer to a center point of the magnetization free layer as being away from the base in a second direction orthogonal to the first plane. A distance from the center point to a first edge is shorter than a distance from the center point to a second edge.

Magnetic field detection device

A magnetic sensorincludes a plurality of MR elements disposed in first to fourth areas. Each of the first to fourth areas includes a first end edge and a second end edge located at both ends in a first reference direction, and a third end edge and a fourth end edge located at both ends in a second reference direction. Each of the first and second end edges extends along the second reference direction. Each of the third and fourth end edges extends along a third reference direction. Each of the plurality of MR elements has a shape long in a direction different from each of the first reference direction, the second reference direction, and the third reference direction.

Magnetic sensor including a plurality of magnetoresistive elements each having long shape in one direction

A magnetic sensor is provided which can improve density of magnetoresistance effect elements without narrowing the wiring pitch. A plurality of element array layersare stacked one on another, each of the element array layers including a plurality of magnetoresistance effect elementsarranged in parallel in an in-plane direction, and magnetoresistance effect elementsin the plurality of element array layersare connected in series to each other.

Magnetic sensor

A multi reader head has a plurality of readers that are laminated via a gap layer(s), and each of the readers has a structure in which a current-perpendicular-to-plane (CPP) type of magneto-resistive effect element, where a current flows along the lamination direction, is interposed between a pair of shields that function as an electrode, respectively, from both sides in the lamination direction. The shields that are opposed from each other via the gap layer of the readers that are adjacent in the lamination direction by a distance that is not constant, but include a portion with a greater distance between the shields and another portion with a smaller distance between the shields are included. The portion with a greater distance between the shields is situated at a position away from the center on an air bearing surface opposing to a recording medium in the magneto-resistive effect element.

Multi reader head having a varying gap layer laminated between readers

A magnetic head includes a magneto-resistance effect element in the form of a multilayer film, a pair of shields between which the magneto-resistance effect element is interposed in the lamination direction of the layers of the magneto-resistance effect element and each functioning as an electrode, a pair of side shields with one of said side shields on each side of the magneto-resistance effect element in the direction perpendicular to the lamination direction of the magneto-resistance effect element interposed between the pair of shields, the side shields magnetically coupled to either of the pair of shields, and an anisotropy-application layer disposed adjacent to the shield magnetically coupled to the pair of side shields. The pair of shields, the magneto-resistance effect element, and the pair of side shields are exposed on the air bearing surface facing a recording medium. The anisotropy-application layer is not exposed on the air bearing surface and is provided at a position away from the air bearing surface.

Magnetic head comprising magneto-resistance effect element and side shields

A magneto-resistive effect element (MR element) has an upper shield that is magnetized in a cross track direction, a lower shield that is positioned at an interval relative to the upper shield in a down track direction, and a multilayer film that is positioned between the upper shield and the lower shield and that faces an air bearing surface (ABS). The multilayer film has a free layer where its magnetization direction fluctuates relative to an external magnetic field, a pinned layer where its magnetization direction is pinned against the external magnetic field, a nonmagnetic spacer layer that is positioned between the free layer and the pinned layer, and an insulating layer that is positioned at a back side of the free layer viewed from the ABS. The MR element further has a pair of side shields that are positioned at both sides of the free layer and the insulating layer in a cross track direction. The side shields contact the upper shield on the sides of the free layer and the insulating layer in the cross track direction.

Magneto-resistive effect element having side shield integrated with upper shield

A manufacturing method of a thin-film magnetic head, includes a step of forming many thin-film magnetic heads arranged along row and column directions on a wafer, each of the thin-film magnetic heads having a read head element, a write head element, and pairs of probe-use pads electrically connected with the read head element and the write head element, respectively, the pairs of probe-use pads being positioned so that at least part of each probe-use pad is removed by a cutting process along the row direction, a step of obtaining a plurality of row-bars by cutting the wafer along the row direction so that the at least part of each probe-use pad is removed, each of the obtained row-bars having the thin-film magnetic heads aligned in the row direction, a step of forming pairs of bonding pads electrically connected with the read head element and the write head element, respectively, on a surface opposite to an ABS of each thin-film magnetic head of each of the row-bars, and a step of cutting each row-bar along the column direction to separate into individual thin-film magnetic heads.

Manufacturing method of thin-film magnetic head, wafer for thin-film magnetic head and thin-film magnetic head

The present invention relates to a wafer formed with an evaluation element and capable of improving productivity and a manufacturing method of an electronic component using the same. In a wafer according to the present invention, a plurality of elements connected to electrode films through lead-out conductive films are arranged and a chip area is defined for cutting out the plurality of elements in a given number. In the wafer, at least one evaluation element is formed in an area outside the chip area. The lead-out conductive films extend to the outside area and are connected to the evaluation elements. With this wafer, since the lead-out conductor is shared between the element and the evaluation element, the electrode film connected therewith can be shared, too. Accordingly, evaluation can be performed by using the evaluation element without the need of providing the wafer with a lead-out conductor and an electrode film exclusively for the evaluation element, so that the chip area to be cut out from the wafer can be made larger than before.

Wafer and manufacturing method of electronic component

The thin-film magnetic head comprises a lower magnetic pole layer, an upper magnetic pole layer and a first thin-film coil. A resist film made of an organic insulating material is interposed between turns adjacent to each other in the lead constituting the first thin-film coil. The first thin-film coil has a minimum width part and a maximum width part. The minimum width part is arranged closer to an air bearing surface than is a second upper magnetic pole part, while the whole upper face of the minimum width part is covered with the resist film. The maximum width part is arranged on the side farther from the air bearing surface than is the second upper magnetic pole part, while the upper face of the maximum width part is formed with a resist-uncoated area free of the resist film.

Thin-film magnetic head

A method of measuring dimension of a first pattern with a narrow first width, and a second pattern with a second width wider than the first width of the first pattern and formed in a symmetrical appearance with respect to a center of the second pattern, the second pattern having edges opposed to each other defining the second width, includes a step of forming a pair of first dummy patterns each having a narrow width, the pair of first dummy patterns being spaced from the edges of the second pattern respectively by a distance approximate to the first width of the first pattern, a first measurement step of measuring, using a dimension measuring device, a spaced distance of one of the first dummy patterns from the edge of the second pattern and a width of the one of the first dummy patterns within the same field of view of the dimension measuring device, a second measurement step of measuring, using the dimension measuring device, a width of the first pattern under the same measurement condition as that of the first measurement step, and a calculation step of calculating a width of the second pattern from W=2D+W+D, where Wis the calculated width of the second pattern, Dis a design value of a distance between the centers of the pair of first dummy patterns, Dis a measured spaced distance of the one of the first dummy patterns from the edge of the second pattern, and Wis a measured width of the one of the first dummy patterns.

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Tokyo, Japan

Tetsuya Hiraki