Hitachi, Ltd.

Other

Thk Co., Ltd.

Hitachi Vlsi Engineering Corp.

Hitachi Hokkai Semiconductor Ltd.

Hitachi Hokkai

Tetsuya Hayashida

Tohru Nakamura

Toru Nishikawa

Masahide Harada

Ryohei Satoh

Mitugu Shirai

Ikuo Yoshida

Kazuo Nakazato

Akira Yamagiwa

Kazuhiko Sagara

Satoshi Imasu

Shinobu Takeura

Hiroshi Kikuchi

Masaharu Kubo

Noriyuki Homma

Motoaki Matsumoto

Toshihiko Tanaka

Norio Hasegawa

Tokuo Kure

Katsuyoshi Washio

Toshihiko Sato

Masahito Ijuin

Hideko Ando

Kiyoji Ikeda

Osamu Yamada

Takeo Yamada

Takeo Shiba

Toshiaki Yamanaka

Katsuhiro Shimohigashi

Yoshio Sakai

Takahiro Daikoku

Toshiaki Masuhara

Osamu Minato

Kanji Otsuka

Fumiyuki Kobayashi

Yoichi Tamaki

Masatada Horiuchi

Takashi Mori

Yasuhiro Iwata

Takahiro Onai

Noriyuki Ashiwake

Akihisa Uchida

Yuzo Taniguchi

Kosuke Inoue

Mitsugu Shirai

Hiroshi Akasaki

Eiji Hosaka

Mitsunori Tamura

Noriyuki Honma

Ryohei Sato

Keizou Kawamura

Toshio Hatsuda

Masakatsu Gotou

Toshihiko Satoh

Norio Kishikawa

Kunihiko Watanabe

Sohji Sakata

Masahide Hara

Hiroko Takehara

Provided is a movable rack unit for taking in and out a storage object with respect to a storage space. The movable rack unit includes a guide part including a track member linearly laid inside the storage space and along a depth direction of the storage space and a moving body that moves along the track member. A support member is rotatably borne on the moving body, and the support member supports the storage object within the storage space. Further, this unit includes a rotation guiding part, and the rotation guiding part changes the attitude of the support member in accordance with the position of the moving body with respect to the track member. When the moving member reaches an opening portion side of the storage space, the rotation guiding part rotates the support member so that merely the support member is set outside the storage space.

Movable rack unit

An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.

Process for mounting electronic device and semiconductor device

The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.

Process for manufacturing electronic circuit devices

Semiconductor device and manufacturing method thereof

In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

Method of fabricating an electronic circuit device and apparatus for performing the method

An electrically reliable heat radiating package provided with a ball grid array (BGA) structure and a method of manufacturing the package are disclosed. A semiconductor chip is mounted on one surface of a ceramic wiring board via first solder bump electrodes and resin is filled in a gap area between the one surface of the wiring board and the principal surface of the semiconductor chip. A heat diffusing plate formed in a larger plane size than that of the semiconductor chip by aluminum nitride is arranged on the rear surface opposite to the principal surface of the semiconductor chip and soldered. Further, a radiating fin made of aluminum is provided on the heat diffusing plate and struck via silicone rubber in which a thermally conductive filler is includes. Further, the above first solder bump electrodes and second solder bump electrodes with a lower melting point than that of the solder used for the above soldering are formed on the rear surface of the above ceramic wiring board, and the above BGA package provided with a heat radiating structure is formed. This BGA package is mounted on a glass epoxy wiring board at low temperature.

For manufacturing a packaged semiconductor device, a lead frame with an electrically insulating strip member and a semiconductor chip is placed in a molding unit having upper and lower dies. The upper and lower dies have recessed areas for determining a size of a cavity of the molding unit different from each other, the size of the cavity being measured in a direction perpendicular to a clamping motion direction of the dies. The lead frame is positioned so that a surface of each lead with the insulating strip member applied thereto is contacted with one of the upper and lower dies having a larger recessed area and a molding line of the molding unit intersects the insulating strip member. The molding unit is closed to clamp the lead frame to depress and thrust into spaces between adjacent leads that part of the strip member which is outside the molding line and to form the cavity of the molding unit. By injecting a molding material into the cavity, a molding package is provided encapsulating the semiconductor chip and a portion of each lead. The packaged semiconductor device has a flanged side surface with an insulating strip provided between a step of the flanged side surface and intermediate portions of the leads which are between first portions of the leads encapsulated in the molding package and second portions of the leads protruding from the flanged side surface.

Packaged semiconductor device having a flange at its side surface and

Method of fabricating an electronic circuit device and apparatus for

A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.

Method of fabricating an electronic circuit device

A semiconductor device has a pellet at the upper surface of a substrate and connects the pellet with a plurality of connecting terminals formed of solder bumps. The connecting terminal group is arranged in the form of a plurality of annular lines in the periphery of the pellet, and a reinforcing resin layer is formed, in the connecting terminal group, of a resin filling a thinner space formed between the pellet and the substrate. At the time of forming the solder bumps, a cutout portion (a vacant area where no bumps are arranged) is formed in the connecting terminal annular line group by means of a cutout part opened at one side of the annular line group, and the reinforcing resin layer is also formed in the cutout portion. Since the air in the thinner space is perfectly exhausted by the effect of the connecting terminal annular line group cutout portion when the vacant area is filled with the reinforcing resin, the generation of an unfilled area in the reinforcing resin layer can be prevented.

Semiconductor device and manufacturing of the same

An apparatus comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to clean a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimentary recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.

Method of fabricating electronic circuit device and apparatus for

In a method of soldering for use in fabricating electronic circuit device, after an oxide layer and/or contaminated layer on a surface of a soldering material and members to be soldered thereby is removed by sputter-cleaning with atom or ion, the members are aligned in an oxidizing atmosphere within a predetermined time period and, then, the soldering material is heated in non-oxidizing atmosphere to performe soldering. An apparatus for performing the above method comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to cleaning a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimental recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.

Growing community of inventors

Hinode-machi, Japan

Tetsuya Hayashida