Kuraray Co., Ltd.

Ube Industries, Inc.

Tetsuya Hara

Kaoru Ikeda

Shinji Tai

Naohiko Uchiumi

Tsugunori Kashimura

Syukiti Kawamura

Shigeru Sasaki

Haruhisa Masuda

Minoru Onodera

Tatsuya Sunamoto

Kozo Tamura

Koji Nakamura

Akio Ohmori

Takahiro Nakashima

Tomoyuki Sano

Hideaki Oka

Ryokei Endo

Takeshi Takahashi

Noriyuki Kida

Tomoharu Nishioka

Yukio Ozeki

Koichi Warino

Michiyuki Nanba

Yuji Munesawa

Koichi Uchida

Takafumi Konno

Akira Kageyu

Yoshio Iwata

Provided are a thermoplastic polymer capable of reducing a dielectric dissipation factor in high frequency bands and a film thereof. The thermoplastic liquid crystal polymer includes repeating units represented by the following formulae (I), (II), (III) and (IV), in which a molar ratio of a total amount of the repeating units represented by formulae (I) and (II) to a total amount of all the repeating units in the thermoplastic liquid crystal polymer is 50 to 90 mol %, and a molar ratio of the repeating unit represented by formula (III) to the repeating unit represented by formula (IV) is the former/the latter=23/77 to 77/23.

Thermoplastic liquid crystal polymer and film of same

Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

Circuit board and method for manufacturing same

The present invention provides a resin composition which comprises EVOH and a thermoplastic resin other than EVOH and which generates less odor and therefore is suitable for food packaging applications. The invention also provides an environmentally friendly method for producing a resin composition, without releasing any carboxylic acid such as acetic acid to the peripheral environment. A resin composition containing less carboxylate group is obtained by contacting an ethylene-vinyl alcohol copolymer resin with an aqueous solution containing both carbon dioxide gas and at least one additive selected from the group consisting of an alkali metal salt (A) and a boron compound (B) and then melt kneading with a thermoplastic resin (G) other than EVOH.

Resin composition and method for producing the same

A conductive polyvinyl alcohol fiber having good mechanical properties and heat resistance contains a polyvinyl alcohol polymer and copper sulfide nano-particles having a mean particle size of at most 50 nm which are finely dispersed in the polymer. The content of the nano-particles in the fiber is at least 0.5% by mass/polyvinyl acohol polymer, and the degree of polymer orientation is at least 60%.

Conductive polyvinyl alcohol fiber

A multi-layer structure excellent in the barrier properties against alcohol gasoline, particularly hydrocarbon components, and also excellent in the interlayer adhesion, low-temperature impact resistance, heat resistance and chemical resistance is provided. The stractive is a multi-layer structure comprising two or more layers including at least a layer (a) comprising (A) nylon 11 and/or nylon 12 and a layer (b) comprising (B) a polyamide resin (nylon 9T) consisting of a dicarboxylic acid component and a-diamine component, with 60 to 100 mol % of the dicarboxylic acid component being a terephthalic acid and 60 to 100 mol % of the diamine component being a diamine component selected from 1,9-nonanediamine and 2-methyl-1,8-octanediamine, and preferably further including a layer (c) comprising (A) nylon 11 and/or nylon 12 or (C) nylon 6.

Multi-layer structure

The present invention provides a resin composition including an ethylene-vinyl alcohol copolymer (EVOH) and a polyamide resin and having outstanding properties in terms of long-term run stability, appearance, and hot water resistance in melt molding. In this resin composition, 70 mol % or more of all the terminal ends of the polyamide resin are blocked with units including an imide structure. At least a portion of the units containing an imide structure may be units containing a cyclic imide structure.

A polyamide composition comprising 50 to 90 parts by weight of (A) semiaromatic polyamides having dicarboxylic acid units containing 60 to 100 mole % of terephthalic acid units and diamine units containing 60 to 100 mole %, in total, of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 50 to 10 parts by weight of (B) aliphatic polyamides in which the average of total carbon atoms of dicarboxylic acid units and diamine units per one amide group is 7 to 12; having excellent moldability, toughness, light-weightness, hot water and steam resistance, heat resistance, mechanical characteristics, low water absorption, chemical resistance and melt stability; and are applicable for molding at low temperature with a conventional steam-heating or a conventional hot-water-heating type mold to give molded articles having sufficient heat resistance, rigidity at high temperature and dimensional stability.

Polyamide composition

A polyamide composition comprising 100 parts by weight of (A) a semiaromatic polyamide having dicarboxylic acid units mainly composed of aromatic dicarboxylic acid units and diamine units mainly composed of aliphatic diamine units having 4 to 14 carbon atoms and containing not more than 15 &#x3bc;eq/g of terminal amino groups; and 0.01 to 5 parts by weight of (B) a copper compound.

The invention provides polyesters of terephthalic acid units and ethylene glycol units, having excellent melt moldability. The invention also provides molded articles having excellent transparency, impact resistance, gelation characteristics, appearance, tactility, mechanical properties, heat resistance, chemical resistance, and dimensional precision.

Copolyesters and molded articles comprising the same

A copolyester consisting essentially of ethylene terephthalate units and further comprising 0.01 to 1 mole % based on the sum of the moles of total diol units and the moles of triol units of a triol unit represented by the following formula (I) and/or a triol unit represented by the following formula (II). ##STR1## wherein A is a group represented by formula --CH.sub.2 CH.sub.2 -- or formula --CH(CH.sub.3)CH.sub.2 --, B is a divalent hydrocarbon group, --CO--, --SO.sub.2 --, --0-- or a direct bond (-), and p, q, r, s, t and u are each an integer of 1 to 8. A process for producing the same and molded articles (in particular extrusion blow molded articles) therefrom. The copolyesters of the present invention are applicable to melt moldings accompanying melt extrusion, in particular extrusion blow molding, where parisons therefrom have good draw-down tendency and blow moldability. The copolyesters can give, without causing troubles on molding, molded articles, in particular extrusion blow molded articles, having excellent transparency, heat resistance, moisture resistance and like properties. Aromatic triols usable for producing the above copolyesters are also provided.

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Kurashiki, Japan

Tetsuya Hara