Screen Holdings Co., Ltd.

Dainippon Screen Mfg. Co., Ltd.

Tetsuya Emoto

Manabu Okutani

Tomomi Iwata

Atsuro Eitoku

Masahiro Kimura

Masayuki Otsuji

Tomonori Kojimaru

Shigeru Yamamoto

Takayoshi Tanaka

Kenji Edamitsu

Keiji Iwata

Yuya Tsuchihashi

Akihiko Taki

Takashi Akiyama

Daiki Fujii

Yuya Kawai

Yuta Nakano

Kenichi Ito

Akira Oato

Teppei Nakano

Reo Tamura

A substrate processing method is provided. The substrate processing method includes: (S) supplying a water repellent agent (SMT) to a substrate (W); (S) supplying dilute isopropyl alcohol (dIPA) to the substrate (W) after the supplying a water repellent agent (SMT), the dilute isopropyl alcohol (dIPA) being obtained by diluting isopropyl alcohol; and (S) drying the substrate (W) after the supplying dilute isopropyl alcohol (dIPA).

Substrate processing method

A low surface tension liquid is supplied from a low surface tension liquid supplying unit to a heated substrate to replace a processing liquid by the low surface tension liquid. The heating of the substrate is weakened and the low surface tension liquid is supplied from the low surface tension liquid supplying unit to the substrate, so that a liquid film of the low surface tension liquid is formed. The liquid film on the substrate is removed by strengthening the heating of the substrate without supplying the low surface tension liquid from the low surface tension liquid supplying unit to a central region of the substrate.

Substrate processing apparatus and substrate processing method

A substrate processing method includes a rinse liquid supplying step of supplying a rinse liquid containing water to a major surface of a substrate, a rotating step of rotating the substrate around a rotation axis passing through a central portion of the major surface of the substrate, and a hydrophobizing agent supplying step of supplying a hydrophobizing agent containing a first dissolving agent to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the hydrophobizing agent in parallel with the rotating step after the rinse liquid supplying step is performed, and the hydrophobizing agent supplying step includes a hydrophobizing agent discharging step of discharging a continuous flow of the hydrophobizing agent from a discharge port of a nozzle toward the major surface of the substrate held by a substrate holding unit with a Reynolds number at the discharge port being not more than 1500.

Substrate processing method and substrate processing apparatus

A substrate processing method includes a replacing step of replacing the processing liquid with a low surface tension liquid, a liquid film forming step of forming a liquid film of the low surface tension liquid on the upper surface of the substrate, by continuing supplying the low surface tension liquid to the upper surface of the substrate after the replacing step, an opening forming step of forming an opening at a central region of the liquid film, an enlarging removing step of removing the liquid film from the upper surface of the substrate by enlarging the opening toward a peripheral edge of the substrate, and a liquid film contact step of bringing a proximity member into contact with the liquid film, by bringing the proximity member close to the peripheral edge of the substrate after starting the opening forming step.

A substrate processing method including a center portion discharging step of discharging a low-surface-tension liquid from a first low-surface-tension liquid nozzle disposed above a substrate toward the center portion of an upper surface, an inert gas supplying step of supplying inert gas to above the substrate in parallel with the center portion discharging step in order to form a gas flow flowing along the upper surface, and a peripheral edge portion discharging and supplying step of discharging the low-surface-tension liquid from a second low-surface-tension liquid nozzle disposed above the substrate toward a peripheral edge portion of the upper surface in parallel with the center portion discharging step and the inert gas supplying step.

Substrate processing method and substrate processing device

A substrate processing method includes a replacement step of replacing a rinse liquid adhered to the front surface of a substrate with a low surface tension liquid whose surface tension is lower than that of the rinse liquid, where the replacement step includes a low surface tension liquid supply step of supplying the low surface tension liquid to the front surface while supplying a heating fluid to the rear surface on a side opposite to the front surface and a post-heating step of supplying the heating fluid to the rear surface on the side opposite to the front surface of the substrate, in a state in which the supply of the low surface tension liquid to the front surface is stopped, before the start of a spin dry step after the completion of the low surface tension liquid supply step.

A hydrophobizing agent vapor is supplied to a substrate and a surface of the substrate including a pattern is hydrophobized. Thereafter, the substrate is dried by vaporizing the hydrophobizing agent. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented.

A substrate treatment method is provided, which includes: a liquid film forming step of forming a liquid film of a treatment liquid on a front surface of a substrate; a hydrophobization liquid supplying step of supplying a hydrophobization liquid to a center portion of the front surface of the substrate for hydrophobizing the front surface of the substrate, while rotating the substrate; an inactivation suppressing step of suppressing inactivation of the supplied hydrophobization liquid on a peripheral edge portion of the front surface of the substrate simultaneously with the hydrophobization liquid supplying step; and a drying step of drying the substrate to which the hydrophobization liquid has been supplied.

Substrate treatment method and substrate treatment apparatus

A hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented.

A liquid hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. A solvent, lower in surface tension than water and capable of dissolving the hydrophobizing agent, is supplied to the substrate in a pre-drying rinsing step. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized.

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Kyoto, Japan

Tetsuya Emoto